View MT48LC16M16A2_4938259.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

256Mb: x4, x8, x16 SDRAM Features
Synchronous DRAM
MT48LC64M4A2 - 16 Meg x 4 x 4 banks MT48LC32M8A2 - 8 Meg x 8 x 4 banks MT48LC16M16A2 - 4 Meg x 16 x 4 banks
For the latest data sheet, refer to Micron's Web site: www.micron.com
Features
* PC100- and PC133-compliant * Fully synchronous; all signals registered on positive edge of system clock * Internal pipelined operation; column address can be changed every clock cycle * Internal banks for hiding row access/precharge * Programmable burst lengths: 1, 2, 4, 8, or full page * Auto precharge, includes concurrent auto precharge, and auto refresh modes * Self refresh mode * 64ms, 8,192-cycle refresh * LVTTL-compatible inputs and outputs * Single +3.3V 0.3V power supply Table 1:
Parameter Configuration
Options
* Configurations - 64 Meg x 4 (16 Meg x 4 x 4 banks) - 32 Meg x 8 (8 Meg x 8 x 4 banks) - 16 Meg x 16 (4 Meg x 16 x 4 banks) * Write recovery (tWR) - tWR = "2 CLK"1 * Plastic package - OCPL2 - 54-pin TSOP II OCPL2 (400 mil) (standard) - 54-pin TSOP II OCPL2 (400 mil) Pb-free - 60-ball FBGA (x4, x8) (8mm x 16mm) - 60-ball FBGA (x4, x8) Pb-free (8mm x 16mm) - 54-ball VFBGA (x16) (8mm x 14 mm) - 54-ball VFBGA (x16) Pb-free (8mm x 14 mm) * Timing (cycle time) - 6.0ns @ CL = 3 (x8, x16 only) - 7.5ns @ CL = 3 (PC133) - 7.5ns @ CL = 2 (PC133) * Self refresh - Standard - Low power * Operating temperature range - Commercial (0C to +70C) - Industrial (-40C to +85C) * Design revision
Marking
64M4 32M8 16M16 A2 TG P FB BB FG BG
Address Table
64 Meg x 4 32 Meg x 8 16 Meg x 16
16 Meg x 4 8 Meg x 8 4 Meg x 16 x 4 banks x 4 banks x 4 banks 8K 8K 8K Refresh count 8K (A0-A12) 8K (A0-A12) 8K (A0-A12) Row addressing 4 (BA0, BA1) 4 (BA0, BA1) 4 (BA0, BA1) Bank addressing 2K (A0-A9, 1K (A0-A9) 512 (A0-A8) Column A11) addressing
-6A -75 -7E None L3 None IT :D
Table 2:
Key Timing Parameters
CL = CAS (READ) latency Access Time CL = 3 5.4ns 5.4ns 5.4ns - -
Speed Grade -6A -7E -75 -7E -75
Clock Frequency CL = 2 167 MHz 143 MHz 133 MHz 133 MHz 100 MHz - - - 5.4ns 6ns
Setup Time 1.5ns 1.5ns 1.5ns 1.5ns 1.5ns
Hold Time 0.8ns 0.8ns 0.8ns 0.8ns 0.8ns
Notes: 1. Refer to Micron technical note: TN-48-05. 2. Off-center parting line. 3. Contact Micron for availability.
Part Number Example:
MT48LC16M16A2TG-75:D
PDF: 09005aef8091e6d1/Source: 09005aef8091e6a8 256MSDRAM_1.fm - Rev. L 10/07 EN
1
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
256Mb: x4, x8, x16 SDRAM Table of Contents Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Pin/Ball Assignments and Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Mode Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Burst Length (BL). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Operating Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Write Burst Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Burst Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 CAS Latency (CL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 The COMMAND INHIBIT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 NO OPERATION (NOP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 LOAD MODE REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 ACTIVE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 PRECHARGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 BURST TERMINATE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 AUTO REFRESH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 SELF REFRESH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 Bank/Row Activation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 READs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 WRITEs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 PRECHARGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Clock Suspend. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Burst Read/Single Write Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 Concurrent Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 READ with Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 WRITE with Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Temperature and Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54 Timing Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
PDF: 09005aef8091e6d1/Source: 09005aef8091e6a8 256MSDRAMTOC.fm - Rev. L 10/07 EN
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Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM List of Figures List of Figures
Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: Figure 11: Figure 12: Figure 13: Figure 14: Figure 15: Figure 16: Figure 17: Figure 18: Figure 19: Figure 20: Figure 21: Figure 22: Figure 23: Figure 24: Figure 25: Figure 26: Figure 27: Figure 28: Figure 29: Figure 30: Figure 31: Figure 32: Figure 33: Figure 34: Figure 35: Figure 36: Figure 37: Figure 38: Figure 39: Figure 40: Figure 41: Figure 42: Figure 43: Figure 44: Figure 45: Figure 46: Figure 47: Figure 48: Figure 49: Figure 50: Figure 51: Figure 52: Figure 53: Figure 54: Figure 55: Figure 56: 64 Meg x 4 SDRAM Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 32 Meg x 8 SDRAM Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 16 Meg x 16 SDRAM Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 54-Pin TSOP Assignment (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 60-Ball FBGA Assignment (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 54-Ball FBGA Assignment (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Mode Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 CAS Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Terminating a WRITE Burst . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Activating a Specific Row in a Specific Bank . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 Example: Meeting tRCD (MIN) When 2 < tRCD (MIN)/tCK 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 READ Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 Consecutive READ Bursts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 Random READ Accesses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 READ-to-WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 READ-to-WRITE with Extra Clock Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 READ-to-PRECHARGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 Terminating a READ Burst . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 WRITE Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 WRITE Burst . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 WRITE-to-WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Random WRITE Cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 WRITE-to-READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 WRITE-to-PRECHARGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 PRECHARGE Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Clock Suspend During WRITE Burst . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Clock Suspend During READ Burst . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 READ With Auto Precharge Interrupted by a READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 READ With Auto Precharge Interrupted by a WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 WRITE With Auto Precharge Interrupted by a READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 WRITE With Auto Precharge Interrupted by a WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 Example Temperature Test Point Location, 54-Pin TSOP: Top View . . . . . . . . . . . . . . . . . . . . . . . . . . .48 Example Temperature Test Point Location, 54-Ball VFBGA: Top View . . . . . . . . . . . . . . . . . . . . . . . . .48 Example Temperature Test Point Location, 60-Ball FBGA: Top View . . . . . . . . . . . . . . . . . . . . . . . . . .48 Initialize and Load Mode Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56 Power-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 Clock Suspend Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 Auto Refresh Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Self Refresh Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60 Read - Without Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61 Read - With Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62 Single Read - Without Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63 Single Read - With Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64 Alternating Bank Read Accesses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Read - Full-Page Burst . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66 Read - DQM Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67 Write - Without Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68 Write - With Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69 Single Write - Without Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70 Single Write - With Auto Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71 Alternating Bank Write Accesses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72 Write - Full-Page Burst . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73 Write - DQM Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74 54-Pin Plastic TSOP (400 mil) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75 60-Ball FBGA "FB" Package, 8mm x 16mm (x4, x8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76 3
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256Mb: x4, x8, x16 SDRAM List of Figures
Figure 57: 54-Ball VFBGA "FG" Package, 8mm x 14mm (x16) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
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Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM List of Tables List of Tables
Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Table 14: Table 15: Table 16: Table 17: Table 18: Table 19: Table 20: Table 21: Table 22: Address Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Key Timing Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 256Mb SDRAM Part Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 54-Pin TSOP Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 54-Ball and 60-Ball FBGA Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Burst Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 CAS Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Truth Table 1 - Commands and DQM Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Truth Table 2 - CKE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Truth Table 3 - Current State Bank n, Command to Bank n . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 Truth Table 4 - Current State Bank n, Command to Bank m . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Temperature Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47 Thermal Impedance Simulated Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47 DC Electrical Characteristics and Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 IDD Specifications and Conditions (-6A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 IDD Specifications and Conditions (-7E, -75) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 Electrical Characteristics and Recommended AC Operating Conditions (-6A) . . . . . . . . . . . . . . . . . .51 Electrical Characteristics and Recommended AC Operating Conditions (-7E, -75) . . . . . . . . . . . . . .52 AC Functional Characteristics (-6A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 AC Functional Characteristics (-7E, -75) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
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Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM General Description
Table 3: 256Mb SDRAM Part Numbers
Part Numbers MT48LC64M4A2TG MT48LC64M4A2P MT48LC64M4A2FB1 MT48LC64M4A2BB1 MT48LC32M8A2TG MT48LC32M8A2P MT48LC32M8A2FB1 MT48LC32M8A2BB1 MT48LC16M16A2TG MT48LC16M16A2P MT48LC16M16A2FG MT48LC16M16A2BG Notes: Architecture 64 Meg x 4 64 Meg x 4 64 Meg x 4 64 Meg x 4 32 Meg x 8 32 Meg x 8 32 Meg x 8 32 Meg x 8 16 Meg x 16 16 Meg x 16 16 Meg x 16 16 Meg x 16 Package 54-pin TSOP II 54-pin TSOP II 60-ball FBGA 60-ball FBGA 54-pin TSOP II 54-pin TSOP II 60-ball FBGA 60-ball FBGA 54-pin TSOP II 54-pin TSOP II 54-ball FBGA 54-ball FBGA
1. Actual FBGA part marking shown on pages 76 and 77.
General Description
The 256Mb SDRAM is a high-speed CMOS, dynamic random-access memory containing 268,435,456 bits. It is internally configured as a quad-bank DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Each of the x4's 67,108,864-bit banks is organized as 8,192 rows by 2,048 columns by 4 bits. Each of the x8's 67,108,864-bit banks is organized as 8,192 rows by 1,024 columns by 8 bits. Each of the x16's 67,108,864-bit banks is organized as 8,192 rows by 512 columns by 16 bits. Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed (BA0, BA1 select the bank; A0-A12 select the row). The address bits registered coincident with the READ or WRITE command are used to select the starting column location for the burst access. The SDRAM provides for programmable read or write burst lengths (BL) of 1, 2, 4, or 8 locations, or the full page, with a burst terminate option. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence. The 256Mb SDRAM uses an internal pipelined architecture to achieve high-speed operation. This architecture is compatible with the 2n rule of prefetch architectures, but it also allows the column address to be changed on every clock cycle to achieve a high-speed, fully random access. Precharging one bank while accessing one of the other three banks will hide the PRECHARGE cycles and provide seamless, high-speed, random-access operation. The 256Mb SDRAM is designed to operate in 3.3V memory systems. An auto refresh mode is provided, along with a power-saving, power-down mode. All inputs and outputs are LVTTL-compatible.
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Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM General Description
SDRAMs offer substantial advances in DRAM operating performance, including the ability to synchronously burst data at a high data rate with automatic column-address generation, the ability to interleave between internal banks to hide precharge time, and the capability to randomly change column addresses on each clock cycle during a burst access. Figure 1: 64 Meg x 4 SDRAM Functional Block Diagram
CKE CLK CS# WE# CAS# RAS# CONTROL LOGIC BANK3 BANK2 BANK1
COMMAND DECODE
MODE REGISTER
REFRESH 13 COUNTER
12 13
ROWADDRESS MUX
13
BANK0 ROWADDRESS 8,192 LATCH & DECODER
BANK0 MEMORY ARRAY (8,192 x 2,048 x 4)
1
1
DQM
SENSE AMPLIFIERS
4
8,192
DATA OUTPUT REGISTER
2
A0-A12, BA0, BA1
15
ADDRESS REGISTER
2
BANK CONTROL LOGIC
I/O GATING DQM MASK LOGIC READ DATA LATCH WRITE DRIVERS
4
4
DQ0DQ3
2,048 (x4)
DATA INPUT REGISTER
COLUMN DECODER COLUMNADDRESS COUNTER/ LATCH
11
11
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Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM General Description
Figure 2: 32 Meg x 8 SDRAM Functional Block Diagram
CKE CLK CS# WE# CAS# RAS# CONTROL LOGIC BANK3 BANK2 BANK1
COMMAND DECODE
MODE REGISTER
REFRESH 13 COUNTER
12 13
ROWADDRESS MUX
13
BANK0 ROWADDRESS 8,192 LATCH & DECODER
BANK0 MEMORY ARRAY (8,192 x 1,024 x 8)
1
1 DQM
SENSE AMPLIFIERS 8 8,192
DATA OUTPUT REGISTER
2 A0-A12, BA0, BA1 ADDRESS REGISTER BANK CONTROL LOGIC
15
I/O GATING DQM MASK LOGIC READ DATA LATCH WRITE DRIVERS 8 1,024 (x8)
8
DQ0- DQ7
2
DATA INPUT REGISTER
COLUMN DECODER COLUMNADDRESS COUNTER/ LATCH 10
10
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Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM General Description
Figure 3: 16 Meg x 16 SDRAM Functional Block Diagram
CKE CLK CS# WE# CAS# RAS# CONTROL LOGIC BANK3 BANK2 BANK1
COMMAND DECODE
MODE REGISTER
REFRESH 13 COUNTER
12 13
ROWADDRESS MUX
13
BANK0 ROWADDRESS 8,192 LATCH & DECODER
BANK0 MEMORY ARRAY (8,192 x 512 x 16)
2
2 DQML, DQMH
SENSE AMPLIFIERS 16 8,192
DATA OUTPUT REGISTER
2 A0-A12, BA0, BA1 ADDRESS REGISTER BANK CONTROL LOGIC
15
I/O GATING DQM MASK LOGIC READ DATA LATCH WRITE DRIVERS 16 512 (x16)
16
DQ0- DQ15
2
DATA INPUT REGISTER
COLUMN DECODER COLUMNADDRESS COUNTER/ LATCH 9
9
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256Mb: x4, x8, x16 SDRAM Pin/Ball Assignments and Descriptions
Pin/Ball Assignments and Descriptions
Figure 4: 54-Pin TSOP Assignment (Top View)
x4 x8 x16
NC
x16 x8 x4
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28
NC
NC DQ0 NC NC DQ0 DQ1 NC NC NC DQ2 NC NC DQ1 DQ3
NC
NC
-
-
VDD DQ0 VDDQ DQ1 DQ2 VssQ DQ3 DQ4 VDDQ DQ5 DQ6 VssQ DQ7 VDD DQML WE# CAS# RAS# CS# BA0 BA1 A10 A0 A1 A2 A3 VDD
Vss DQ15 DQ7 VssQ DQ14 NC DQ13 DQ6 VDDQ DQ12 NC DQ11 DQ5 VssQ DQ10 NC DQ9 DQ4 VDDQ DQ8 NC Vss NC DQMH DQM CLK CKE A12 A11 A9 A8 A7 A6 A5 A4 Vss -
NC
NC DQ3
NC NC
NC DQ2
NC
DQM
-
Notes:
1. The # symbol indicates signal is active LOW. A dash (-) indicates x8 and x4 pin function is same as x16 pin function.
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256Mb: x4, x8, x16 SDRAM Pin/Ball Assignments and Descriptions
Figure 5: 60-Ball FBGA Assignment (Top View)
64 Meg x 4 SDRAM 8mm x 16mm "FB"
1 2 3 4 5 6 7 8 1 2
32 Meg x 8 SDRAM 8mm x 16mm "FB"
3 4 5 6 7 8
A B C D E F G H J K L M N P R
NC NC VDDQ NC NC VDDQ NC NC NC NC A12 A11 A8 A6 A4
Vss VssQ DQ3 NC VssQ DQ2 NC Vss DQM CK CKE A9 A7 A5 Vss
VDD VDDQ DQ0 NC VDDQ DQ1 NC VDD WE# RAS# NC BA1 A0 A2 VDD
NC NC VssQ NC NC VssQ NC NC CAS# NC CS# BA0 A10 A1 A3
A B C D E F G H J K L M N P R
DQ7 NC VDDQ DQ5 NC VDDQ NC NC NC NC A12 A11 A8 A6 A4
Vss VssQ DQ6 NC VssQ DQ4 NC Vss DQM CK CKE A9 A7 A5 Vss
VDD VDDQ DQ1 NC VDDQ DQ3 NC VDD WE# RAS# NC BA1 A0 A2 VDD
DQ0 NC VssQ DQ2 NC VssQ NC NC CAS# NC CS# BA0 A10 A1 A3
Depopulated Balls
Note:
Depopulated Balls
FBGA pin symbol, type, and descriptions are identical to the listing in Table 4 on page 13.
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256Mb: x4, x8, x16 SDRAM Pin/Ball Assignments and Descriptions
Figure 6: 54-Ball FBGA Assignment (Top View)
1 2 3 4 5 6 7 8 9
A B C D E F G H J
Vss DQ14 DQ12 DQ10 DQ8 UDQM A12 A8 Vss
DQ15 DQ13 DQ11 DQ9 NC CLK A11 A7 A5
VSSQ VDDQ VSSQ VDDQ Vss CKE A9 A6 A4
VDDQ VssQ VDDQ VSSQ VDD CAS# BA0 A0 A3
DQ0 DQ2 DQ4 DQ6 LDQM RAS# BA1 A1 A2
VDD DQ1 DQ3 DQ5 DQ7 WE# CS# A10 VDD
Depopulated Balls
Notes: 1. The balls at A4, A5, and A6 are absent from the physical package. They are included to illustrate that rows 4, 5, and 6 exist, but contain no solder balls.
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256Mb: x4, x8, x16 SDRAM Pin/Ball Assignments and Descriptions
Table 4: 54-Pin TSOP Descriptions
Symbol CLK Type Input Description Clock: CLK is driven by the system clock. All SDRAM input signals are sampled on the positive edge of CLK. CLK also increments the internal burst counter and controls the output registers. Clock enable: CKE activates (HIGH) and deactivates (LOW) the CLK signal. Deactivating the clock provides PRECHARGE power-down and SELF REFRESH operation (all banks idle), ACTIVE power-down (row active in any bank), or CLOCK SUSPEND operation (burst/access in progress). CKE is synchronous except after the device enters power-down and self refresh modes, where CKE becomes asynchronous until after exiting the same mode. The input buffers, including CLK, are disabled during power-down and self refresh modes, providing low standby power. CKE may be tied HIGH. Chip select: CS# enables (registered LOW) and disables (registered HIGH) the command decoder. All commands are masked when CS# is registered HIGH, but READ/WRITE bursts already in progress will continue and DQM operation will retain its DQ mask capability while CS# is HIGH. CS# provides for external bank selection on systems with multiple banks. CS# is considered part of the command code. Command inputs: WE#, CAS#, and RAS# (along with CS#) define the command being entered. Input/output mask: DQM is an input mask signal for write accesses and an output enable signal for read accesses. Input data is masked when DQM is sampled HIGH during a WRITE cycle. The output buffers are placed in a High-Z state (two-clock latency) when DQM is sampled HIGH during a READ cycle. On the x4 and x8, DQML (Pin 15) is a NC and DQMH is DQM. On the x16, DQML corresponds to DQ0-DQ7 and DQMH corresponds to DQ8-DQ15. DQML and DQMH are considered same state when referenced as DQM. Bank address inputs: BA0 and BA1 define to which bank the ACTIVE, READ, WRITE, or PRECHARGE command is being applied. Address inputs: A0-A12 are sampled during the ACTIVE command (rowaddress A0-A12) and READ or WRITE command (column-address A0-A9, A11 [x4]; A0-A9 [x8]; A0-A8 [x16]; with A10 defining auto precharge) to select one location out of the memory array in the respective bank. A10 is sampled during a PRECHARGE command to determine whether all banks are to be precharged (A10 [HIGH]) or bank selected by (A10 [LOW]). The address inputs also provide the op-code during a LOAD MODE REGISTER command. Data input/output: Data bus for x16 (pins 4, 7, 10, 13, 42, 45, 48, and 51 are NCs for x8; and pins 2, 4, 7, 8, 10, 13, 42, 45, 47, 48, 51, and 53 are NCs for x4). Data input/output: Data bus for x8 (pins 2, 8, 47, 53 are NCs for x4). Data input/output: Data bus for x4. No connect: This pin should be left unconnected. DQ power: DQ power to the die for improved noise immunity. DQ ground: DQ ground to the die for improved noise immunity. Power supply: +3.3V 0.3V. Ground.
Pin Numbers 38
37
CKE
Input
19
CS#
Input
16, 17, 18 39 15, 39
WE#, CAS#, RAS# x4, x8: DQM x16: DQML, DQMH
Input Input
20, 21 23-26, 29-34, 22, 35, 36
BA0, BA1 A0-A12
Input Input
2, 4, 5, 7, 8, 10, 11, 13, 42, 44, 45, 47, 48, 50, 51, 53 2, 5, 8, 11, 44, 47, 50, 53 5, 11, 44, 50 40 3, 9, 43, 49 6, 12, 46, 52 1, 14, 27 28, 41, 54
DQ0-DQ15
x16: I/O
DQ0-DQ7 DQ0-DQ3 NC VDDQ VSSQ VDD VSS
x8: I/O x4: I/O - Supply Supply Supply Supply
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Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM Pin/Ball Assignments and Descriptions
Table 5:
54-Ball FBGA F2
54-Ball and 60-Ball FBGA Descriptions
60-Ball FBGA K2 Symbol CLK Type Input Description Clock: CLK is driven by the system clock. All SDRAM input signals are sampled on the positive edge of CLK. CLK also increments the internal burst counter and controls the output registers. Clock enable: CKE activates (HIGH) and deactivates (LOW) the CLK signal. Deactivating the clock provides PRECHARGE power-down and SELF REFRESH operation (all banks idle), ACTIVE power-down (row active in any bank), or CLOCK SUSPEND operation (burst/access in progress). CKE is synchronous except after the device enters powerdown and self refresh modes, where CKE becomes asynchronous until after exiting the same mode. The input buffers, including CLK, are disabled during power-down and self refresh modes, providing low standby power. CKE may be tied HIGH. Chip select: CS# enables (registered LOW) and disables (registered HIGH) the command decoder. All commands are masked when CS# is registered HIGH, but READ/WRITE bursts already in progress will continue and DQM operation will retain its DQ mask capability while CS# is HIGH. CS# provides for external bank selection on systems with multiple banks. CS# is considered part of the command code. Command inputs: CAS#, RAS#, and WE# (along with CS#) define the command being entered. Input/output mask: DQM is sampled HIGH and is an input mask signal for write accesses and an output enable signal for read accesses. Input data is masked during a WRITE cycle. The output buffers are placed in a High-Z state (two-clock latency) when during a READ cycle. LDQM corresponds to DQ0-DQ7; UDQM corresponds to DQ8-DQ15. LDQM and UDQM are considered same state when referenced as DQM. Bank address input(s): BA0 and BA1 define to which bank the ACTIVE, READ, WRITE, or PRECHARGE command is being applied. These balls also provide the op-code during a LOAD MODE REGISTER command. Address inputs: A0-A12 are sampled during the ACTIVE command (row-address A0-A12) and READ or WRITE command (column-address A0-A9, A11 [x4]; A0-A9 [x8]; A0-A8 [x16]; with A10 defining auto precharge) to select one location out of the memory array in the respective bank. A10 is sampled during a PRECHARGE command to determine whether all banks are to be precharged (A10 HIGH) or bank selected by BA0, BA1 (LOW). The address inputs also provide the opcode during a LOAD MODE REGISTER command. Data input/output: Data bus.
F3
L2
CKE
Input
G9
L8
CS#
Input
F7, F8, F9 E8, F1
J8, K7, J7 J2
CAS#, RAS#, WE# DQM, LDQM, UDQM
Input Input
G7, G8
M8, M7
BA0, BA1
Input
H7, H8, J8, J7, J3, J2, H3, H2, H1, G3, H9, G2, G1
N7, P8, P7, R8, R1, P2, P1, N2, N1, M2, N8, M1, L1
A0-A12
Input
A8, B9, B8, C9, C8, D9, D8, E9, E1, D2, D1, C2, C1, B2, B1, A2 C7, F7, F2, C2 A8, C7, D8, F7, F2, D1, C2, A1 E2
DQ0-DQ15
I/O
DQ0-DQ3 DQ0-DQ7
(x4) I/O Data input/output: Data bus. (x8) I/O Data input/output: Data bus.
NC
-
No connect: These balls should be left unconnected.
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256Mb: x4, x8, x16 SDRAM Functional Description
Table 5:
54-Ball FBGA
54-Ball and 60-Ball FBGA Descriptions (continued)
60-Ball FBGA A1, A8, B1, B8, D1, D2, D7, D8, E1, E8, G1, G2, G7, G8, H1, H8, J1, K1, K8, L7 B1, B8, D2, D7, E1, E8, G1, G2, G7, G8, H1, H8, J1, K1, K8, L7 B7, C1, E7, F1 B2, C8, E2, F8 A7, R7 A2, H2, R2 Symbol NC Type x4 Description No connect: These balls should be left unconnected. G1 is a no connect for this part, but may be used as A12 in future designs.
NC
x8
No connect: These balls should be left unconnected. G1 is a no connect for this part, but may be used as A12 in future designs.
A7, B3, C7, D3 A3, B7, C3, D7 A9, E7, J9 A1, E3, J1
VDDQ VSSQ VDD VSS
Supply DQ power: DQ power to the die for improved noise immunity. Supply DQ ground: DQ ground to the die for improved noise immunity. Supply Power supply: Voltage dependent on option. Supply Ground.
Functional Description
In general, the 256Mb SDRAMs (16 Meg x 4 x 4 banks, 8 Meg x 8 x 4 banks, and 4 Meg x 16 x 4 banks) are quad-bank DRAMs that operate at 3.3V and include a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Each of the x4's 67,108,864-bit banks is organized as 8,192 rows by 2,048 columns by 4 bits. Each of the x8's 67,108,864-bit banks is organized as 8,192 rows by 1,024 columns by 8 bits. Each of the x16's 67,108,864-bit banks is organized as 8,192 rows by 512 columns by 16 bits. Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed (BA0 and BA1 select the bank, A0-A12 select the row). The address bits (x4: A0-A9, A11; x8: A0-A9; x16: A0-A8) registered coincident with the READ or WRITE command are used to select the starting column location for the burst access. Prior to normal operation, the SDRAM must be initialized. The following sections provide detailed information covering device initialization, register definition, command descriptions, and device operation.
Initialization
SDRAMs must be powered up and initialized in a predefined manner. Operational procedures other than those specified may result in undefined operation. After power is applied to VDD and VDDQ (simultaneously) and the clock is stable (stable clock is defined as a signal cycling within timing constraints specified for the clock pin), the SDRAM requires a 100s delay prior to issuing any command other than a COMMAND
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256Mb: x4, x8, x16 SDRAM Functional Description
INHIBIT or NOP Starting at some point during this 100s period and continuing at least . through the end of this period, COMMAND INHIBIT or NOP commands must be applied. After the 100s delay has been satisfied with at least one COMMAND INHIBIT or NOP command having been applied, a PRECHARGE command should be applied. All banks must then be precharged, thereby placing the device in the all banks idle state. Once in the idle state, at least two AUTO REFRESH cycles must be performed. After the AUTO REFRESH cycles are complete, the SDRAM is ready for mode register programming. Because the mode register will power up in an unknown state, it must be loaded prior to applying any operational command. If desired, the two AUTO REFRESH commands can be issued after the LMR command. The recommended power-up sequence for SDRAMs: 1. Simultaneously apply power to VDD and VDDQ. 2. Assert and hold CKE at a LVTTL logic LOW since all inputs and outputs are LVTTLcompatible. 3. Provide stable CLOCK signal. Stable clock is defined as a signal cycling within timing constraints specified for the clock pin. 4. Wait at least 100s prior to issuing any command other than a COMMAND INHIBIT or NOP. 5. Starting at some point during this 100s period, bring CKE HIGH. Continuing at least through the end of this period, 1 or more COMMAND INHIBIT or NOP commands must be applied. 6. Perform a PRECHARGE ALL command. 7. Wait at least tRP time; during this time NOPs or DESELECT commands must be given. All banks will complete their precharge, thereby placing the device in the all banks idle state. 8. Issue an AUTO REFRESH command. 9. Wait at least tRFC time, during which only NOPs or COMMAND INHIBIT commands are allowed. 10. Issue an AUTO REFRESH command. 11. Wait at least tRFC time, during which only NOPs or COMMAND INHIBIT commands are allowed. 12. The SDRAM is now ready for mode register programming. Because the mode register will power up in an unknown state, it should be loaded with desired bit values prior to applying any operational command. Using the LMR command, program the mode register. The mode register is programmed via the MODE REGISTER SET command with BA1 = 0, BA0 = 0 and retains the stored information until it is programmed again or the device loses power. Not programming the mode register upon initialization will result in default settings which may not be desired. Outputs are guaranteed High-Z after the LMR command is issued. Outputs should be High-Z already before the LMR command is issued. 13. Wait at least tMRD time, during which only NOP or DESELECT commands are allowed. At this point the DRAM is ready for any valid command. Note: If desired, more than two AUTO REFRESH commands can be issued in the sequence. After steps 9 and 10 are complete, repeat them until the desired number of AUTO REFRESH + tRFC loops is achieved.
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256Mb: x4, x8, x16 SDRAM Functional Description Register Definition
Mode Register The mode register is used to define the specific mode of operation of the SDRAM. This definition includes the selection of BL, a burst type, CL, an operating mode, and a write burst mode, as shown in Figure 7 on page 18. The mode register is programmed via the LOAD MODE REGISTER command and will retain the stored information until it is programmed again or the device loses power. Mode register bits M0-M2 specify BL, M3 specifies the type of burst (sequential or interleaved), M4-M6 specify CL, M7, and M8 specify the operating mode, M9 specifies the write burst mode, and M10 and M11 are reserved for future use. Address A12 (M12) is undefined but should be driven LOW during loading of the mode register. The mode register must be loaded when all banks are idle, and the controller must wait the specified time before initiating the subsequent operation. Violating either of these requirements will result in unspecified operation. Burst Length (BL) Read and write accesses to the SDRAM are burst oriented, with BL being programmable, as shown in Figure 7 on page 18. BL determines the maximum number of column locations that can be accessed for a given READ or WRITE command. Burst lengths of 1, 2, 4, or 8 locations are available for both the sequential and the interleaved burst types, and a full-page burst is available for the sequential mode. The full-page burst is used in conjunction with the BURST TERMINATE command to generate arbitrary BLs. Reserved states cannot be used, because unknown operation or incompatibility with future versions may result. When a READ or WRITE command is issued, a block of columns equal to BL is effectively selected. All accesses for that burst take place within this block, meaning that the burst will wrap within the block if a boundary is reached. The block is uniquely selected by A1- A9, A11 (x4), A1-A9 (x8) or A1-A8 (x16) when BL = 2; by A2-A9, A11 (x4), A2-A9 (x8) or A2-A8 (x16) when BL = 4; and by A3-A9, A11 (x4), A3-A9 (x8) or A3-A8 (x16) when BL = 8. The remaining (least significant) address bit(s) is (are) used to select the starting location within the block. Full-page bursts wrap within the page if the boundary is reached.
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256Mb: x4, x8, x16 SDRAM Functional Description
Figure 7: Mode Register Definition
A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 Address Bus
12
11
10
9
8
7
6
5
4
3 BT
2
1
0
Mode Register (Mx)
Reserved
WB Op Mode
CAS Latency
Burst Length
Program BA1, BA0 = "0, 0" to ensure compatibility with future devices.
Burst Length M2 M1 M0 0 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 M3 = 0 1 2 4 8 Reserved Reserved Reserved Full Page M3 = 1 1 2 4 8 Reserved Reserved Reserved Reserved
M9 0 1
Write Burst Mode Programmed Burst Length Single Location Access
0 0 0 1
M8 0 -
M7 0 -
M6-M0 Defined -
Operating Mode Standard Operation All other states reserved
1 1 1
M3 0 1
Burst Type Sequential Interleaved
M6 M5 M4 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1
CAS Latency Reserved Reserved 2 3 Reserved Reserved Reserved Reserved
Operating Mode The normal operating mode is selected by setting M7 and M8 to zero; the other combinations of values for M7 and M8 are reserved for future use and/or test modes. The programmed BL applies to both READ and WRITE bursts. Test modes and reserved states should not be used because unknown operation or incompatibility with future versions may result. Write Burst Mode When M9 = 0, BL programmed via M0-M2 applies to both READ and WRITE bursts; when M9 = 1, the programmed BL applies to READ bursts, but write accesses are singlelocation (nonburst) accesses.
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256Mb: x4, x8, x16 SDRAM Functional Description
Burst Type Accesses within a given burst may be programmed either to be sequential or interleaved; this is referred to as the burst type and is selected via bit M3. The ordering of accesses within a burst is determined by BL, the burst type, and the starting column address, as shown in Table 6. Table 6: Burst Definition
Burst Length 2 Order of Accesses Within a Burst Starting Column Address A0 0 1 A1 A0 0 0 0 1 1 0 1 1 A1 A0 0 0 0 1 1 0 1 1 0 0 0 1 1 0 1 1 n = A0-A11/9/8 (location 0-y) Type = Sequential 0-1 1-0 0-1-2-3 1-2-3-0 2-3-0-1 3-0-1-2 0-1-2-3-4-5-6-7 1-2-3-4-5-6-7-0 2-3-4-5-6-7-0-1 3-4-5-6-7-0-1-2 4-5-6-7-0-1-2-3 5-6-7-0-1-2-3-4 6-7-0-1-2-3-4-5 7-0-1-2-3-4-5-6 Cn, Cn + 1, Cn + 2 Cn + 3, Cn + 4... ...Cn - 1, Cn... Type = Interleaved 0-1 1-0 0-1-2-3 1-0-3-2 2-3-0-1 3-2-1-0 0-1-2-3-4-5-6-7 1-0-3-2-5-4-7-6 2-3-0-1-6-7-4-5 3-2-1-0-7-6-5-4 4-5-6-7-0-1-2-3 5-4-7-6-1-0-3-2 6-7-4-5-2-3-0-1 7-6-5-4-3-2-1-0 Not supported
4
8
A2 0 0 0 0 1 1 1 1
Full page (y)
Notes:
1. For full-page accesses: y = 2,048 (x4); y = 1,024 (x8); y = 512 (x16). 2. For BL = 2, A1-A9, A11 (x4); A1-A9 (x8); or A1-A8 (x16) select the block-of-two burst; A0 selects the starting column within the block. 3. For BL = 4, A2-A9, A11 (x4); A2-A9 (x8); or A2-A8 (x16) select the block-of-four burst; A0- A1 select the starting column within the block. 4. For BL = 8, A3-A9, A11 (x4); A3-A9 (x8); or A3-A8 (x16) select the block-of-eight burst; A0- A2 select the starting column within the block. 5. For a full-page burst, the full row is selected and A0-A9, A11 (x4); A0-A9 (x8); or A0-A8 (x16) select the starting column. 6. Whenever a boundary of the block is reached within a given sequence above, the following access wraps within the block. 7. For BL = 1, A0-A9, A11 (x4); A0-A9 (x8); or A0-A8 (x16) select the unique column to be accessed, and mode register bit M3 is ignored.
CAS Latency (CL) CL is the delay, in clock cycles, between the registration of a READ command and the availability of the first piece of output data. The latency can be set to two or three clocks.
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256Mb: x4, x8, x16 SDRAM Functional Description
If a READ command is registered at clock edge n and the latency is m clocks, the data will be available by clock edge n + m. The DQs will start driving as a result of the clock edge one cycle earlier (n + m - 1), and provided that the relevant access times are met, the data will be valid by clock edge n + m. For example, assuming that the clock cycle time is such that all relevant access times are met, if a READ command is registered at T0 and the latency is programmed to two clocks, the DQs will start driving after T1 and the data will be valid by T2, as shown in Figure 8. Table 7 on page 21 indicates the operating frequencies at which each CL setting can be used. Reserved states cannot be used as unknown operation or incompatibility with future versions may result. Figure 8: CAS Latency
T0 CLK COMMAND T1 T2 T3
READ
NOP tLZ
NOP tOH DOUT
DQ tAC CL = 2
T0 CLK COMMAND
T1
T2
T3
T4
READ
NOP
NOP tLZ
NOP tOH DOUT
DQ tAC CL = 3
DON'T CARE UNDEFINED
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256Mb: x4, x8, x16 SDRAM Functional Description
Table 7: CAS Latency
Allowable Operating Frequency (MHz) Speed
1
CL = 2
CL = 3
Notes:
133 167 -6A 2 133 143 -7E -75 100 133 1. -6A speed grade supports latency of 3-3-3 cycles (CAS latency-tRCD-tRP) at 167 MHz (MAX). 2. -7E speed grade supports latency of 2-2-2 cycles at 133 MHz (MAX).
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256Mb: x4, x8, x16 SDRAM Commands
Commands
Truth Table 1 provides a quick reference of available commands. This is followed by a written description of each command. Three additional Truth Tables appear following "Operations" on page 25; these tables provide current state/next state information. Table 8: Truth Table 1 - Commands and DQM Operation
Note: 1 applies to the entire table Name (Function) COMMAND INHIBIT (NOP) NO OPERATION (NOP) ACTIVE (Select bank and activate row) READ (Select bank and column, and start READ burst) WRITE (Select bank and column, and start WRITE burst) BURST TERMINATE PRECHARGE (Deactivate row in bank or banks) AUTO REFRESH or SELF REFRESH (Enter self refresh mode) LOAD MODE REGISTER Write enable/output enable Write inhibit/output High-Z Notes: 1. 2. 3. 4. CS# H L L L L L L L L - - RAS# X H L H H H L L L - - CAS# X H H L L H H L L - - WE# X H H H L L L H L - - DQM X X X L/H8 L/H8 X X X X L H ADDR X X Bank/row Bank/col Bank/col X Code X Op-code - - DQs X X X X Valid Active X X X Active High-Z Notes
3 4 4
5 6, 7 2 8 8
5. 6. 7. 8.
CKE is HIGH for all commands shown except SELF REFRESH. A0-A11 define the op-code written to the mode register, and A12 should be driven LOW. A0-A12 provide row address, and BA0, BA1 determine which bank is made active. A0-A9, A11 (x4); A0-A9 (x8); or A0-A8 (x16) provide column address; A10 HIGH enables the auto precharge feature (nonpersistent), while A10 LOW disables the auto precharge feature; BA0, BA1 determine which bank is being read from or written to. A10 LOW: BA0, BA1 determine the bank being precharged. A10 HIGH: All banks precharged and BA0, BA1 are "Don't Care." This command is AUTO REFRESH if CKE is HIGH, SELF REFRESH if CKE is LOW. Internal refresh counter controls row addressing; all inputs and I/Os are "Don't Care" except for CKE. Activates or deactivates the DQs during WRITEs (zero-clock delay) and READs (two-clock delay).
The COMMAND INHIBIT
The COMMAND INHIBIT function prevents new commands from being executed by the SDRAM, regardless of whether the CLK signal is enabled. The SDRAM is effectively deselected. Operations already in progress are not affected.
NO OPERATION (NOP)
The NO OPERATION (NOP) command is used to perform a NOP to an SDRAM that is selected (CS# is LOW). This prevents unwanted commands from being registered during idle or wait states. Operations already in progress are not affected.
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256Mb: x4, x8, x16 SDRAM Commands LOAD MODE REGISTER
The mode register is loaded via inputs A0-A11 (A12 should be driven LOW.) See "Register Definition" on page 17. The LOAD MODE REGISTER command can only be issued when all banks are idle, and a subsequent executable command cannot be issued until tMRD is met.
ACTIVE
The ACTIVE command is used to open (or activate) a row in a particular bank for a subsequent access. The value on the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-A12 selects the row. This row remains active (or open) for accesses until a PRECHARGE command is issued to that bank. A PRECHARGE command must be issued before opening a different row in the same bank.
READ
The READ command is used to initiate a burst read access to an active row. The value on the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-A9, A11 (x4), A0-A9 (x8), or A0-A8 (x16) selects the starting column location. The value on input A10 determines whether auto precharge is used. If auto precharge is selected, the row being accessed will be precharged at the end of the READ burst; if auto precharge is not selected, the row will remain open for subsequent accesses. Read data appears on the DQs subject to the logic level on the DQM inputs two clocks earlier. If a given DQM signal was registered HIGH, the corresponding DQs will be High-Z two clocks later; if the DQM signal was registered LOW, the DQs will provide valid data.
WRITE
The WRITE command is used to initiate a burst write access to an active row. The value on the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-A9; A11 (x4); A0-A9 (x8); or A0-A8 (x16) selects the starting column location. The value on input A10 determines whether auto precharge is used. If auto precharge is selected, the row being accessed will be precharged at the end of the WRITE burst; if auto precharge is not selected, the row will remain open for subsequent accesses. Input data appearing on the DQs is written to the memory array subject to the DQM input logic level appearing coincident with the data. If a given DQM signal is registered LOW, the corresponding data will be written to memory; if the DQM signal is registered HIGH, the corresponding data inputs will be ignored, and a WRITE will not be executed to that byte/column location.
PRECHARGE
The PRECHARGE command is used to deactivate the open row in a particular bank or the open row in all banks. The bank(s) will be available for a subsequent row access a specified time (tRP) after the PRECHARGE command is issued. Input A10 determines whether one or all banks are to be precharged, and in the case where only one bank is to be precharged, inputs BA0, BA1 select the bank. Otherwise BA0, BA1 are treated as "Don't Care." After a bank has been precharged, it is in the idle state and must be activated prior to any READ or WRITE commands being issued to that bank.
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256Mb: x4, x8, x16 SDRAM Commands Auto Precharge
Auto precharge is a feature that performs the same individual-bank precharge function described above, without requiring an explicit command. This is accomplished by using A10 to enable auto precharge in conjunction with a specific READ or WRITE command. A precharge of the bank/row that is addressed with the READ or WRITE command is automatically performed upon completion of the READ or WRITE burst, except in the full-page burst mode, where auto precharge does not apply. Auto precharge is nonpersistent in that it is either enabled or disabled for each individual READ or WRITE command. Auto precharge ensures that the precharge is initiated at the earliest valid stage within a burst. The user must not issue another command to the same bank until the precharge time (tRP) is completed. This is determined as if an explicit PRECHARGE command was issued at the earliest possible time, as described for each burst type in "Operations" on page 25.
BURST TERMINATE
The BURST TERMINATE command is used to truncate either fixed-length or full-page bursts. The most recently registered READ or WRITE command prior to the BURST TERMINATE command will be truncated, as shown in "Operations" on page 25. The BURST TERMINATE command does not precharge the row; the row will remain open until a PRECHARGE command is issued. Figure 9: Terminating a WRITE Burst
T0 CLK T1 T2
COMMAND
WRITE
BURST TERMINATE
NEXT COMMAND
ADDRESS
BANK, COL n
(ADDRESS)
DQ
DIN n
(DATA)
TRANSITIONING DATA
DON'T CARE
Note:
DQM is LOW.
AUTO REFRESH
AUTO REFRESH is used during normal operation of the SDRAM and is analogous to CAS#-BEFORE-RAS# (CBR) refresh in conventional DRAMs. This command is nonpersistent, so it must be issued each time a refresh is required. All active banks must be precharged prior to issuing an AUTO REFRESH command. The AUTO REFRESH command should not be issued until the minimum tRP has been met after the PRECHARGE command, as shown in "Operations" on page 25. The addressing is generated by the internal refresh controller. This makes the address bits a "Don't Care" during an AUTO REFRESH command. The 256Mb SDRAM requires 8,192 AUTO REFRESH cycles every 64ms (tREF), regardless of width option. Providing a
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256Mb: x4, x8, x16 SDRAM Operations
distributed AUTO REFRESH command every 7.81s will meet the refresh requirement and ensure that each row is refreshed. Alternatively, 8,192 AUTO REFRESH commands can be issued in a burst at the minimum cycle rate (tRFC), once every 64ms.
SELF REFRESH
The SELF REFRESH command can be used to retain data in the SDRAM, even if the rest of the system is powered down. When in the self refresh mode, the SDRAM retains data without external clocking. The SELF REFRESH command is initiated like an AUTO REFRESH command except CKE is disabled (LOW). After the SELF REFRESH command is registered, all the inputs to the SDRAM become a "Don't Care" with the exception of CKE, which must remain LOW. After self refresh mode is engaged, the SDRAM provides its own internal clocking, causing it to perform its own AUTO REFRESH cycles. The SDRAM must remain in self refresh mode for a minimum period equal to tRAS and may remain in self refresh mode for an indefinite period beyond that. The procedure for exiting self refresh requires a sequence of commands. First, CLK must be stable (stable clock is defined as a signal cycling within timing constraints specified for the clock pin) prior to CKE going back HIGH. After CKE is HIGH, the SDRAM must have NOP commands issued (a minimum of two clocks) for tXSR because time is required for the completion of any internal refresh in progress. Upon exiting the self refresh mode, AUTO REFRESH commands must be issued every 7.81s or less as both SELF REFRESH and AUTO REFRESH utilize the row refresh counter.
Operations
Bank/Row Activation
Before any READ or WRITE commands can be issued to a bank within the SDRAM, a row in that bank must be "opened." This is accomplished via the ACTIVE command, which selects both the bank and the row to be activated (see Figure 10 on page 26). After opening a row (issuing an ACTIVE command), a READ or WRITE command may be issued to that row, subject to the tRCD specification. tRCD (MIN) should be divided by the clock period and rounded up to the next whole number to determine the earliest clock edge after the ACTIVE command on which a READ or WRITE command can be entered. For example, a tRCD specification of 20ns with a 125 MHz clock (8ns period) results in 2.5 clocks, rounded to 3. This is reflected in Figure 11 on page 26, which covers any case where 2 < tRCD (MIN)/tCK 3. (The same procedure is used to convert other specification limits from time units to clock cycles.) A subsequent ACTIVE command to a different row in the same bank can only be issued after the previous active row has been "closed" (precharged). The minimum time interval between successive ACTIVE commands to the same bank is defined by tRC. A subsequent ACTIVE command to another bank can be issued while the first bank is being accessed, which results in a reduction of total row-access overhead. The minimum time interval between successive ACTIVE commands to different banks is defined by t RRD.
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256Mb: x4, x8, x16 SDRAM Operations
Figure 10: Activating a Specific Row in a Specific Bank
CLK CKE CS# HIGH
RAS#
CAS#
WE#
A0-A12
ROW ADDRESS
BA0, BA1
BANK ADDRESS
DON'T CARE
Figure 11:
Example: Meeting tRCD (MIN) When 2 < tRCD (MIN)/tCK 3
T0 CLK T1 T2 T3 T4
COMMAND
ACTIVE
NOP
NOP
READ or WRITE
tRCD
DON'T CARE
READs
READ bursts are initiated with a READ command, as shown in Figure 12 on page 27. The starting column and bank addresses are provided with the READ command, and auto precharge is either enabled or disabled for that burst access. If auto precharge is enabled, the row being accessed is precharged at the completion of the burst. For the generic READ commands used in the following illustrations, auto precharge is disabled. During READ bursts, the valid data-out element from the starting column address will be available following CL after the READ command. Each subsequent data-out element will be valid by the next positive clock edge. Figure 13 on page 28 shows general timing for each possible CL setting. Upon completion of a burst, assuming no other commands have been initiated, the DQs will go High-Z. A full-page burst will continue until terminated. (At the end of the page, it will wrap to the start address and continue.) Data from any READ burst may be truncated with a subsequent READ command, and data from a fixed-length READ burst may be immediately followed by data from a READ command. In either case, a continuous flow of data can be maintained. The first data
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element from the new burst follows either the last element of a completed burst or the last desired data element of a longer burst that is being truncated. The new READ command should be issued x cycles before the clock edge at which the last desired data element is valid, where x = CL - 1. This is shown in Figure 13 on page 28 for CL = 2 and CL = 3; data element n + 3 is either the last of a burst of four or the last desired of a longer burst. The 256Mb SDRAM uses a pipelined architecture and therefore does not require the 2n rule associated with a prefetch architecture. A READ command can be initiated on any clock cycle following a previous READ command. Full-speed random read accesses can be performed to the same bank, as shown in Figure 14 on page 29, or each subsequent READ may be performed to a different bank. Figure 12: READ Command
CLK CKE CS# HIGH
RAS#
CAS#
WE# A0-A9, A11: x4 A0-A9: x8 A0-A8: x16 A12: x4 A11, A12: x8 A9, A11, A12: x16
ENABLE AUTO PRECHARGE
COLUMN ADDRESS
A10
DISABLE AUTO PRECHARGE BANK ADDRESS
BA0, BA1
DON'T CARE
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Figure 13: Consecutive READ Bursts
T0 CLK T1 T2 T3 T4 T5 T6
COMMAND
READ
NOP
NOP
NOP
READ
NOP
NOP
X = 1 cycle
ADDRESS
BANK, COL n
BANK, COL b
DQ
CL = 2
DOUT n
DOUT n+1
DOUT n+2
DOUT n+3
DOUT b
T0 CLK
T1
T2
T3
T4
T5
T6
T7
COMMAND
READ
NOP
NOP
NOP
READ
NOP
NOP
NOP
X = 2 cycles
ADDRESS
BANK, COL n
BANK, COL b
DQ
CL = 3
DOUT n
DOUT n+1
DOUT n+2
DOUT n+3
DOUT b
TRANSITIONING DATA
DON'T CARE
Note:
Each READ command may be to any bank. DQM is LOW.
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Figure 14: Random READ Accesses
T0 CLK T1 T2 T3 T4 T5
COMMAND
READ
READ
READ
READ
NOP
NOP
ADDRESS
BANK, COL n
BANK, COL a
BANK, COL x
BANK, COL m
DQ
CL = 2
DOUT n
DOUT a
DOUT x
DOUT m
T0 CLK
T1
T2
T3
T4
T5
T6
COMMAND
READ
READ
READ
READ
NOP
NOP
NOP
ADDRESS
BANK, COL n
BANK, COL a
BANK, COL x
BANK, COL m
DQ
CL = 3
DOUT n
DOUT a
DOUT x
DOUT m
TRANSITIONING DATA
DON'T CARE
Note:
Each READ command may be to any bank. DQM is LOW.
Data from any READ burst may be truncated with a subsequent WRITE command, and data from a fixed-length READ burst may be immediately followed by data from a WRITE command (subject to bus turnaround limitations). The WRITE burst may be initiated on the clock edge immediately following the last (or last desired) data element from the READ burst, provided that I/O contention can be avoided. In a given system design, there may be a possibility that the device driving the input data will go Low-Z before the SDRAM DQs go High-Z. In this case, at least a single-cycle delay should occur between the last read data and the WRITE command. The DQM input is used to avoid I/O contention, as shown in Figure 15 and Figure 16 on page 30. The DQM signal must be asserted (HIGH) at least two clocks prior to the WRITE command (DQM latency is two clocks for output buffers) to suppress data-out from the READ. Once the WRITE command is registered, the DQs will go High-Z (or remain High-Z), regardless of the state of the DQM signal; provided the DQM was active on the clock just prior to the WRITE command that truncated the READ command. If not, the second WRITE will be an invalid WRITE. For example, if DQM was LOW during T4 in Figure 11 on page 26, then the WRITEs at T5 and T7 would be valid, while the WRITE at T6 would be invalid.
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256Mb: x4, x8, x16 SDRAM Operations
The DQM signal must be de-asserted prior to the WRITE command (DQM latency is zero clocks for input buffers) to ensure that the written data is not masked. Figure 10 on page 26 shows the case where the clock frequency allows for bus contention to be avoided without adding a NOP cycle, and Figure 16 shows the case where the additional NOP is needed. Figure 15: READ-to-WRITE
T0 CLK DQM T1 T2 T3 T4
COMMAND ADDRESS
READ
NOP
NOP
NOP
WRITE
BANK, COL n
BANK, COL b
tCK tHZ DQ
DOUT n DIN b
tDS
Note:
CL = 3 is used for illustration. The READ command may be to any bank, and the WRITE command may be to any bank. If a burst of one is used, then DQM is not required.
Figure 16:
READ-to-WRITE with Extra Clock Cycle
T0 CLK DQM T1 T2 T3 T4 T5
COMMAND ADDRESS
READ
NOP
NOP
NOP
NOP
WRITE
BANK, COL n
BANK, COL b
tHZ DQ
DOUT n DIN b
tDS
TRANSITIONING DATA
DON'T CARE
Note:
CL = 3 is used for illustration. The READ command may be to any bank, and the WRITE command may be to any bank.
A fixed-length READ burst may be followed by, or truncated with, a PRECHARGE command to the same bank (provided that auto precharge was not activated), and a fullpage burst may be truncated with a PRECHARGE command to the same bank. The PRECHARGE command should be issued x cycles before the clock edge at which the last desired data element is valid, where x = CL - 1. This is shown in Figure 17 on page 31 for each possible CL; data element n + 3 is either the last of a burst of four or the last desired
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of a longer burst. Following the PRECHARGE command, a subsequent command to the same bank cannot be issued until tRP is met. Note that part of the row precharge time is hidden during the access of the last data element(s). In the case of a fixed-length burst being executed to completion, a PRECHARGE command issued at the optimum time (as described above) provides the same operation that would result from the same fixed-length burst with auto precharge. The disadvantage of the PRECHARGE command is that it requires command and address buses to be available at the appropriate time to issue the command; the advantage of the PRECHARGE command is that it can be used to truncate fixed-length or full-page bursts. Full-page READ bursts can be truncated with the BURST TERMINATE command, and fixed-length READ bursts may be truncated with a BURST TERMINATE command, provided that auto precharge was not activated. The BURST TERMINATE command should be issued x cycles before the clock edge at which the last desired data element is valid, where x = CL - 1. This is shown in Figure 18 on page 32 for each possible CL; data element n + 3 is the last desired data element of a longer burst. Figure 17: READ-to-PRECHARGE
T0 CLK
t RP
T1
T2
T3
T4
T5
T6
T7
COMMAND
READ
NOP
NOP
NOP
PRECHARGE X = 1 cycle
NOP
NOP
ACTIVE
ADDRESS
BANK a, COL n
BANK (a or all)
BANK a, ROW
DQ
CL = 2
DOUT n
DOUT n+1
DOUT n+2
DOUT n+3
T0 CLK
T1
T2
T3
T4
T5
T6
T7
t RP
COMMAND
READ
NOP
NOP
NOP
PRECHARGE
NOP
NOP
ACTIVE
X = 2 cycles
ADDRESS
BANK a, COL n
BANK (a or all)
BANK a, ROW
DQ
CL = 3
DOUT n
DOUT n+1
DOUT n+2
DOUT n+3
TRANSITIONING DATA
DON'T CARE
Note:
DQM is LOW.
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Figure 18: Terminating a READ Burst
T0 CLK T1 T2 T3 T4 T5 T6
COMMAND
READ
NOP
NOP
NOP
BURST TERMINATE X = 1 cycle
NOP
NOP
ADDRESS
BANK, COL n
DQ
CL = 2
DOUT n
DOUT n+1
DOUT n+2
DOUT n+3
T0 CLK
T1
T2
T3
T4
T5
T6
T7
COMMAND
READ
NOP
NOP
NOP
BURST TERMINATE
NOP
NOP
NOP
X = 2 cycles
ADDRESS
BANK, COL n
DQ
CL = 3
DOUT n
DOUT n+1
DOUT n+2
DOUT n+3
TRANSITIONING DATA
DON'T CARE
Note:
DQM is LOW.
WRITEs
WRITE bursts are initiated with a WRITE command, as shown in Figure 19 on page 33. The starting column and bank addresses are provided with the WRITE command, and auto precharge is either enabled or disabled for that access. If auto precharge is enabled, the row being accessed is precharged at the completion of the burst. For the generic WRITE commands used in the following illustrations, auto precharge is disabled. During WRITE bursts, the first valid data-in element will be registered coincident with the WRITE command. Subsequent data elements will be registered on each successive positive clock edge. Upon completion of a fixed-length burst, assuming no other commands have been initiated, the DQs will remain High-Z, and any additional input data will be ignored (see Figure 20 on page 33). A full-page burst will continue until terminated. (At the end of the page, it will wrap to the start address and continue.)
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Figure 19: WRITE Command
CLK CKE CS# HIGH
RAS#
CAS#
WE# A0-A9, A11: x4 A0-A9: x8 A0-A8: x16 A12: x4 A11, A12: x8 A9, A11, A12: x16
ENABLE AUTO PRECHARGE
COLUMN ADDRESS
A10
DISABLE AUTO PRECHARGE
BA0, BA1
BANK ADDRESS
Figure 20:
WRITE Burst
T0 CLK T1 T2 T3
COMMAND
WRITE
NOP
NOP
NOP
ADDRESS
BANK, COL n
DQ
DIN n
DIN n+1
TRANSITIONING DATA
DON'T CARE
Note:
BL = 2. DQM is LOW.
Data for any WRITE burst may be truncated with a subsequent WRITE command, and data for a fixed-length WRITE burst may be immediately followed by data for a WRITE command. The new WRITE command can be issued on any clock following the previous WRITE command, and the data provided coincident with the new command applies to the new command. An example is shown in Figure 21 on page 34. Data n + 1 is either the last of a burst of two or the last desired of a longer burst. The 256Mb SDRAM uses a pipelined architecture and therefore does not require the 2n rule associated with a prefetch architecture. A WRITE command can be initiated on any clock cycle following a previous WRITE command. Full-speed random write accesses within a page can be performed to the same bank, as shown in Figure 22 on page 34, or each subsequent WRITE may be performed to a different bank.
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256Mb: x4, x8, x16 SDRAM Operations
Data for any WRITE burst may be truncated with a subsequent READ command, and data for a fixed-length WRITE burst may be immediately followed by a READ command. After the READ command is registered, the data inputs will be ignored, and WRITEs will not be executed. An example is shown in Figure 23. Data n + 1 is either the last of a burst of two or the last desired of a longer burst. Figure 21: WRITE-to-WRITE
T0 CLK T1 T2
COMMAND
WRITE
NOP
WRITE
ADDRESS
BANK, COL n
BANK, COL b
DQ
DIN n
DIN n+1
DIN b
Note:
DQM is LOW. Each WRITE command may be to any bank.
Figure 22:
Random WRITE Cycles
T0 CLK T1 T2 T3
COMMAND
WRITE
WRITE
WRITE
WRITE
ADDRESS
BANK, COL n
BANK, COL a
BANK, COL x
BANK, COL m
DQ
DIN n
DIN a
DIN x
DIN m
Figure 23:
WRITE-to-READ
T0 CLK T1 T2 T3 T4 T5
COMMAND
WRITE
NOP
READ
NOP
NOP
NOP
ADDRESS
BANK, COL n
BANK, COL b
DQ
DIN n
DIN n+1
DOUT b
DOUT b+1
TRANSITIONING DATA
DON'T CARE
Data for a fixed-length WRITE burst may be followed by, or truncated with, a PRECHARGE command to the same bank (provided that auto precharge was not activated), and a full-page WRITE burst may be truncated with a PRECHARGE command to the same bank. The PRECHARGE command should be issued tWR after the clock edge at
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which the last desired input data element is registered. The auto precharge mode requires a tWR of at least one clock plus time, regardless of frequency. In addition, when truncating a WRITE burst, the DQM signal must be used to mask input data for the clock edge prior to, and the clock edge coincident with, the PRECHARGE command. An example is shown in Figure 24. Data n + 1 is either the last of a burst of two or the last desired of a longer burst. Following the PRECHARGE command, a subsequent command to the same bank cannot be issued until tRP is met. The PRECHARGE is issued coincident with the second clock (see Figure 24). In the case of a fixed-length burst being executed to completion, a PRECHARGE command issued at the optimum time (as described above) provides the same operation that would result from the same fixed-length burst with auto precharge. The disadvantage of the PRECHARGE command is that it requires that the command and address buses be available at the appropriate time to issue the command; the advantage of the PRECHARGE command is that it can be used to truncate fixed-length or full-page bursts. Fixed-length or full-page WRITE bursts can be truncated with the BURST TERMINATE command. When truncating a WRITE burst, the input data applied coincident with the BURST TERMINATE command will be ignored. The last data written (provided that DQM is LOW at that time) will be the input data applied one clock previous to the BURST TERMINATE command. This is shown in Figure 9 on page 24, where data n is the last desired data element of a longer burst. Figure 24: WRITE-to-PRECHARGE
T0 CLK tWR @ tCLK 15ns DQM
t RP
T1
T2
T3
T4
T5
T6
COMMAND
WRITE
NOP
PRECHARGE
NOP
NOP
ACTIVE
NOP
ADDRESS
BANK a, COL n
t WR
BANK (a or all)
BANK a, ROW
DQ
DIN n
DIN n+1
tWR = tCLK < 15ns DQM
t RP
COMMAND ADDRESS
WRITE
NOP
NOP
PRECHARGE
NOP
NOP
ACTIVE
BANK a, COL n
t WR
BANK (a or all)
BANK a, ROW
DQ
DIN n
DIN n+1
TRANSITIONING DATA
DON'T CARE
Note:
DQM could remain LOW in this example if the WRITE burst is a fixed length of two.
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256Mb: x4, x8, x16 SDRAM Operations PRECHARGE
The PRECHARGE command (see Figure 25 on page 36) is used to deactivate the open row in a particular bank or the open row in all banks. The bank(s) will be available for a subsequent row access some specified time (tRP) after the PRECHARGE command is issued. Input A10 determines whether one or all banks are to be precharged, and in the case where only one bank is to be precharged, inputs BA0, BA1 select the bank. When all banks are to be precharged, inputs BA0, BA1 are treated as "Don't Care." After a bank has been precharged, it is in the idle state and must be activated prior to any READ or WRITE commands being issued to that bank.
Power-Down
Power-down occurs if CKE is registered LOW coincident with a NOP or COMMAND INHIBIT when no accesses are in progress. If power-down occurs when all banks are idle, this mode is referred to as precharge power-down; if power-down occurs when there is a row active in any bank, this mode is referred to as active power-down. Entering power-down deactivates the input and output buffers, excluding CKE, for maximum power savings while in standby. The device may not remain in the power-down state longer than the refresh period (64ms) since no REFRESH operations are performed in this mode. The power-down state is exited by registering a NOP or COMMAND INHIBIT and CKE HIGH at the desired clock edge (meeting tCKS). See Figure 26 on page 37. Figure 25: PRECHARGE Command
CLK CKE CS# HIGH
RAS#
CAS#
WE#
A0-A9, A11, A12
All Banks
A10
Bank Selected
BA0, BA1
BANK ADDRESS
DON'T CARE
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Figure 26: Power-Down
CLK tCKS CKE
(( )) (( ))
> tCKS
(( ))
COMMAND
NOP
(( )) (( ))
NOP
ACTIVE
All banks idle Input buffers gated off Enter power-down mode. Exit power-down mode.
tRCD tRAS tRC DON'T CARE
Clock Suspend
The clock suspend mode occurs when a column access/burst is in progress and CKE is registered LOW. In the clock suspend mode, the internal clock is deactivated, "freezing" the synchronous logic. For each positive clock edge on which CKE is sampled LOW, the next internal positive clock edge is suspended. Any command or data present on the input pins at the time of a suspended internal clock edge is ignored; any data present on the DQ pins remains driven; and burst counters are not incremented, as long as the clock is suspended. (See examples in Figure 27 and Figure 28 on page 38.) Clock suspend mode is exited by registering CKE HIGH; the internal clock and related operation will resume on the subsequent positive clock edge. Figure 27: Clock Suspend During WRITE Burst
T0 CLK T1 T2 T3 T4 T5
CKE
INTERNAL CLOCK
COMMAND
NOP
WRITE
NOP
NOP
ADDRESS
BANK, COL n
DIN
DIN n
DIN n+1
DIN n+2
TRANSITIONING DATA
DON'T CARE
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Figure 28: Clock Suspend During READ Burst
T0 CLK T1 T2 T3 T4 T5 T6
CKE
INTERNAL CLOCK
COMMAND
READ
NOP
NOP
NOP
NOP
NOP
ADDRESS
BANK, COL n
DQ
DOUT n
DOUT n+1
DOUT n+2
DOUT n+3
TRANSITIONING DATA
DON'T CARE
Note:
For this example, CL = 2, BL = 4 or greater, and DQM is LOW.
Burst Read/Single Write Mode
The burst read/single write mode is entered by programming the WRITE burst mode bit (M9) in the mode register to a logic 1. In this mode, all WRITE commands result in the access of a single column location (burst of one), regardless of the programmed BL. READ commands access columns according to the programmed BL and sequence, just as in the normal mode of operation (M9 = 0).
Concurrent Auto Precharge
An access command (READ or WRITE) to another bank while an access command with auto precharge enabled is executing is not allowed by SDRAMs, unless the SDRAM supports concurrent auto precharge. Micron SDRAMs support concurrent auto precharge. Four cases where concurrent auto precharge occurs are defined below. READ with Auto Precharge * Interrupted by a READ (with or without auto precharge): A READ to bank m will interrupt a READ on bank n, CL later. The precharge to bank n will begin when the READ to bank m is registered (Figure 29 on page 39). * Interrupted by a WRITE (with or without auto precharge): A WRITE to bank m will interrupt a READ on bank n when registered. DQM should be used two clocks prior to the WRITE command to prevent bus contention. The precharge to bank n will begin when the WRITE to bank m is registered (Figure 30 on page 39). WRITE with Auto Precharge * Interrupted by a READ (with or without auto precharge): A READ to bank m will interrupt a WRITE on bank n when registered, with the data-out appearing CL later. The precharge to bank n will begin after tWR is met, where tWR begins when the READ to bank m is registered. The last valid WRITE to bank n will be data-in registered one clock prior to the READ to bank m (Figure 31 on page 40).
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* Interrupted by a WRITE (with or without auto precharge): A WRITE to bank m will interrupt a WRITE on bank n when registered. The precharge to bank n will begin after tWR is met, where tWR begins when the WRITE to bank m is registered. The last valid data WRITE to bank n will be data registered one clock prior to a WRITE to bank m (Figure 32 on page 40). Figure 29: READ With Auto Precharge Interrupted by a READ
T0 CLK
READ - AP BANK n READ - AP BANK m
T1
T2
T3
T4
T5
T6
T7
COMMAND BANK n
NOP
NOP
NOP
NOP
NOP
NOP
Page Active
READ with Burst of 4
Interrupt Burst, Precharge t RP - BANK n
Idle tRP - BANK m Precharge
Internal States
BANK m
Page Active
READ with Burst of 4
ADDRESS DQ
BANK n, COL a
BANK m, COL d DOUT a CL = 3 (BANK n) CL = 3 (BANK m) DOUT a+1 DOUT d DOUT d+1
TRANSITIONING DATA
DON'T CARE
Notes:
1. DQM is LOW.
Figure 30:
READ With Auto Precharge Interrupted by a WRITE
T0 CLK
READ - AP BANK n Page Active WRITE - AP BANK m
T1
T2
T3
T4
T5
T6
T7
COMMAND BANK n
NOP
NOP
NOP
NOP
NOP
NOP
READ with Burst of 4
Interrupt Burst, Precharge tRP - BANK n
Idle t WR - BANK m Write-Back
Internal States
BANK m
BANK n, COL a
Page Active
WRITE with Burst of 4
ADDRESS DQM
1
BANK m, COL d
DQ
CL = 3 (BANK n)
DOUT a
DIN d
DIN d+1
DIN d+2
DIN d+3
TRANSITIONING DATA
DON'T CARE
Notes:
1. DQM is HIGH at T2 to prevent DOUT - a + 1 from contending with DIN - d at T4.
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Figure 31: WRITE With Auto Precharge Interrupted by a READ
T0 CLK
WRITE - AP BANK n READ - AP BANK m
T1
T2
T3
T4
T5
T6
T7
COMMAND BANK n
NOP
NOP
NOP
NOP
NOP
NOP
Page Active
WRITE with Burst of 4
Interrupt Burst, Write-Back tWR - BANK n
Precharge tRP - BANK n tRP - BANK m
Internal States
BANK m
Page Active
READ with Burst of 4
ADDRESS DQ
BANK n, COL a DIN a DIN a+1
BANK m, COL d DOUT d CL = 3 (BANK m) DOUT d+1
TRANSITIONING DATA
DON'T CARE
Notes:
1. DQM is LOW.
Figure 32:
WRITE With Auto Precharge Interrupted by a WRITE
T0 CLK
WRITE - AP BANK n WRITE - AP BANK m
T1
T2
T3
T4
T5
T6
T7
COMMAND BANK n
NOP
NOP
NOP
NOP
NOP
NOP
Page Active
WRITE with Burst of 4
Interrupt Burst, Write-Back Precharge tWR - BANK n tRP - BANK n t WR - BANK m Write-Back
Internal States
BANK m
Page Active
WRITE with Burst of 4
ADDRESS DQ
BANK n, COL a DIN a DIN a+1 DIN a+2
BANK m, COL d DIN d DIN d+1 DIN d+2 DIN d+3
TRANSITIONING DATA
DON'T CARE
Notes:
1. DQM is LOW.
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Table 9:
CKEn - 1 L
Truth Table 2 - CKE
Notes 1-4 apply to the entire table CKEn L Current State Power-down Self refresh Clock suspend Power-down Self refresh Clock suspend All banks idle All banks idle Reading or writing Notes: Commandn X X X COMMAND INHIBIT or NOP COMMAND INHIBIT or NOP X COMMAND INHIBIT or NOP AUTO REFRESH WRITE or NOP See Table 10 on page 42 Actionn Maintain power-down Maintain self refresh Maintain clock suspend Exit power-down Exit self refresh Exit clock suspend Power-down entry Self refresh entry Clock suspend entry Notes
L
H
5 6 7
H
L
H
H
1. CKEn is the logic state of CKE at clock edge n; CKEn - 1 was the state of CKE at the previous clock edge. 2. Current state is the state of the SDRAM immediately prior to clock edge n. 3. Commandn is the command registered at clock edge n, and Actionn is a result of Commandn. 4. All states and sequences not shown are illegal or reserved. 5. Exiting power-down at clock edge n will put the device in the all banks idle state in time for clock edge n + 1 (provided that tCKS is met). 6. Exiting self refresh at clock edge n will put the device in the all banks idle state after tXSR is met. COMMAND INHIBIT or NOP commands should be issued on any clock edges occurring during the tXSR period. A minimum of two NOP commands must be provided during tXSR period. 7. After exiting clock suspend at clock edge n, the device will resume operation and recognize the next command at clock edge n + 1.
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Table 10:
Current State Any Idle
Truth Table 3 - Current State Bank n, Command to Bank n
Notes 1-6 apply to the entire table; notes appear below and on page 43 CS# H L L L L L L L L L L L L L L L L Notes: RAS# X H L L L L H H L H H L H H H L H CAS# X H H L L H L L H L L H H L L H H WE# X H H H L L H L L H L L L H L L L Command (Action) COMMAND INHIBIT (NOP/continue previous operation) NO OPERATION (NOP/continue previous operation) ACTIVE (Select and activate row) AUTO REFRESH LOAD MODE REGISTER PRECHARGE READ (Select column and start READ burst) WRITE (Select column and start WRITE burst) PRECHARGE (Deactivate row in bank or banks) READ (Select column and start new READ burst) WRITE (Select column and start WRITE burst) PRECHARGE (Truncate READ burst, start PRECHARGE) BURST TERMINATE READ (Select column and start READ burst) WRITE (Select column and start new WRITE burst) PRECHARGE (Truncate WRITE burst, start PRECHARGE) BURST TERMINATE Notes
Row active
Read (auto precharge disabled) Write (auto precharge disabled)
7 7 11 10 10 8 10 10 8 9 10 10 8 9
1. This table applies when CKEn-1 was HIGH and CKEn is HIGH (see Table 9 on page 41) and after tXSR has been met (if the previous state was self refresh). 2. This table is bank-specific, except where noted, that is, the current state is for a specific bank, and the commands shown are those allowed to be issued to that bank when in that state. Exceptions are covered in the notes below. 3. Current state definitions: Idle: The bank has been precharged, and tRP has been met. Row active: A row in the bank has been activated, and tRCD has been met. No data bursts/accesses and no register accesses are in progress. Read: A READ burst has been initiated, with auto precharge disabled, and has not yet terminated or been terminated. Write: A WRITE burst has been initiated, with auto precharge disabled, and has not yet terminated or been terminated. 4. The following states must not be interrupted by a command issued to the same bank. COMMAND INHIBIT or NOP commands or allowable commands to the other bank should be issued on any clock edge occurring during these states. Allowable commands to the other bank are determined by its current state and Table 10 and according to Table 11 on page 44. Precharging: Starts with registration of a PRECHARGE command and ends when tRP is met. After tRP is met, the bank will be in the idle state. Row activating: Starts with registration of an ACTIVE command and ends when tRCD is met. After tRCD is met, the bank will be in the row active state. Read w/auto Starts with registration of a READ command with auto precharge precharge enabled: enabled and ends when tRP has been met. After tRP is met, the bank will be in the idle state. Write w/auto Starts with registration of a WRITE command with auto precharge precharge enabled: enabled and ends when tRP has been met. After tRP is met, the bank will be in the idle state.
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5. The following states must not be interrupted by any executable command; COMMAND INHIBIT or NOP commands must be applied on each positive clock edge during these states. Refreshing: Starts with registration of an AUTO REFRESH command and ends when t RC is met. After tRC is met, the SDRAM will be in the all banks idle state. Accessing mode Starts with registration of a LOAD MODE REGISTER command and ends register: when tMRD has been met. After tMRD is met, the SDRAM will be in the all banks idle state. Precharging all: Starts with registration of a PRECHARGE ALL command and ends when t RP is met. After tRP is met, all banks will be in the idle state. All states and sequences not shown are illegal or reserved. Not bank-specific; requires that all banks are idle. May or may not be bank-specific; if all banks are to be precharged, all must be in a valid state for precharging. Not bank-specific; BURST TERMINATE affects the most recent READ or WRITE burst, regardless of bank. READs or WRITEs listed in the Command (Action) column include READs or WRITEs with auto precharge enabled and READs or WRITEs with auto precharge disabled. Does not affect the state of the bank and acts as a NOP to that bank.
6. 7. 8. 9. 10. 11.
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Table 11:
Current State Any Idle Row activating, active, or precharging Read (auto precharge disabled) Write (auto precharge disabled) Read (with auto precharge) Write (with auto precharge)
Truth Table 4 - Current State Bank n, Command to Bank m
Notes 1-6 apply to the entire table; notes appear below and on page 45 CS# H L X L L L L L L L L L L L L L L L L L L L L Notes: RAS# X H X L H H L L H H L L H H L L H H L L H H L CAS# X H X H L L H H L L H H L L H H L L H H L L H WE# X H X H H L L H H L L H H L L H H L L H H L L Command (Action) COMMAND INHIBIT (NOP/continue previous operation) NO OPERATION (NOP/continue previous operation) Any command otherwise allowed to bank m ACTIVE (Select and activate row) READ (Select column and start READ burst) WRITE (Select column and start WRITE burst) PRECHARGE ACTIVE (Select and activate row) READ (Select column and start new READ burst) WRITE (Select column and start WRITE burst) PRECHARGE ACTIVE (Select and activate row) READ (Select column and start READ burst) WRITE (Select column and start new WRITE burst) PRECHARGE ACTIVE (Select and activate row) READ (Select column and start new READ burst) WRITE (Select column and start WRITE burst) PRECHARGE ACTIVE (Select and activate row) READ (Select column and start READ burst) WRITE (Select column and start new WRITE burst) PRECHARGE Notes
7 7
7, 10 7, 11 9 7, 12 7, 13 9 7, 8, 14 7, 8, 15 9 7, 8, 16 7, 8, 17 9
1. This table applies when CKEn - 1 was HIGH and CKEn is HIGH (see Table 9 on page 41) and after tXSR has been met (if the previous state was self refresh). 2. This table describes alternate bank operation, except where noted; that is, the current state is for bank n and the commands shown are those allowed to be issued to bank m (assuming that bank m is in such a state that the given command is allowable). Exceptions are covered in the notes below. 3. Current state definitions: Idle: The bank has been precharged, and tRP has been met. Row active: A row in the bank has been activated, and tRCD has been met. No data bursts/accesses and no register accesses are in progress. Read: A READ burst has been initiated, with auto precharge disabled, and has not yet terminated or been terminated. Write: A WRITE burst has been initiated, with auto precharge disabled, and has not yet terminated or been terminated. Read w/auto Starts with registration of a READ command with auto precharge precharge enabled: enabled, and ends when tRP has been met. After tRP is met, the bank will be in the idle state. Write w/auto Starts with registration of a WRITE command with auto precharge precharge enabled: enabled, and ends when tRP has been met. After tRP is met, the bank will be in the idle state. 4. AUTO REFRESH, SELF REFRESH, and LOAD MODE REGISTER commands may only be issued when all banks are idle.
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5. A BURST TERMINATE command cannot be issued to another bank; it applies to the bank represented by the current state only. 6. All states and sequences not shown are illegal or reserved. 7. READs or WRITEs to bank m listed in the Command (Action) column include READs or WRITEs with auto precharge enabled and READs or WRITEs with auto precharge disabled. 8. CONCURRENT AUTO PRECHARGE: bank n will initiate the AUTO PRECHARGE command when its burst has been interrupted by bank m's burst. 9. Burst in bank n continues as initiated. 10. For a READ without auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt the READ on bank n, CL later (see Figure 13 on page 28). 11. For a READ without auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will interrupt the READ on bank n when registered (see Figures 15 and 16 on page 30). DQM should be used one clock prior to the WRITE command to prevent bus contention. 12. For a WRITE without auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt the WRITE on bank n when registered (see Figure 23 on page 34), with the data-out appearing CL later. The last valid WRITE to bank n will be data-in registered one clock prior to the READ to bank m. 13. For a WRITE without auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will interrupt the WRITE on bank n when registered (see Figure 21 on page 34). The last valid WRITE to bank n will be data-in registered one clock prior to the READ to bank m. 14. For a READ with auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt the READ on bank n, CL later. The precharge to bank n will begin when the READ to bank m is registered (see Figure 29 on page 39). 15. For a READ with auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will interrupt the READ on bank n when registered. DQM should be used two clocks prior to the WRITE command to prevent bus contention. The precharge to bank n will begin when the WRITE to bank m is registered (see Figure 30 on page 39). 16. For a WRITE with auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt the WRITE on bank n when registered, with the data-out appearing CL later. The precharge to bank n will begin after tWR is met, where tWR begins when the READ to bank m is registered. The last valid WRITE to bank n will be data-in registered one clock prior to the READ to bank m (see Figure 31 on page 40). 17. For a WRITE with auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will interrupt the WRITE on bank n when registered. The precharge to bank n will begin after tWR is met, where tWR begins when the WRITE to bank m is registered. The last valid WRITE to bank n will be data registered one clock prior to the WRITE to bank m (see Figure 32 on page 40).
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Electrical Specifications
Stresses greater than those listed in Table 12 may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Table 12:
Parameter Voltage on VDD; VDDQ supply relative to VSS Voltage on inputs, NC, or I/O pins relative to VSS Operating temperature TA (commercial) TA (industrial "IT") Storage temperature (plastic) Power dissipation
Absolute Maximum Ratings
Min -1 -1 0 -40 -55 - Max +4.6 +4.6 +70 +85 +150 1 Units V V C C C W
Temperature and Thermal Impedance
It is imperative that the SDRAM device's temperature specifications, shown in Table 13 on page 47, be maintained to ensure the junction temperature is in the proper operating range to meet data sheet specifications. An important step in maintaining the proper junction temperature is using the device's thermal impedances correctly. The thermal impedances are listed in Table 14 on page 47 for the applicable die revision and packages being made available. These thermal impedance values vary according to the density, package, and particular design used for each device. Incorrectly using thermal impedances can produce significant errors. Read Micron technical note TN-00-08, "Thermal Applications" prior to using the thermal impedances listed in Table 14. To ensure the compatibility of current and future designs, contact Micron Applications Engineering to confirm thermal impedance values. The SDRAM device's safe junction temperature range can be maintained when the TC specification is not exceeded. In applications where the device's ambient temperature is too high, use of forced air and/or heat sinks may be required to satisfy the case temperature specifications.
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Table 13:
Parameter Operating case temperature: Commercial Industrial Junction temperature: Commercial Industrial Ambient temperature: Commercial Industrial Peak reflow temperature Notes:
Temperature Limits
Symbol TC 0 -40 TJ 0 -40 TA 0 -40 - 70 85 260 85 95 C 3, 5 80 90 C 3 Min Max Units C Notes 1, 2, 3, 4
TPEAK
C
1. MAX operating case temperature, TC, is measured in the center of the package on the top side of the device, as shown in Figure 33, Figure 34, and Figure 35 on page 48. 2. Device functionality is not guaranteed if the device exceeds maximum TC during operation. 3. Both temperature specifications must be satisfied. 4. The case temperature should be measured by gluing a thermocouple to the top center of the component. This should be done with a 1mm bead of conductive epoxy, as defined by the JEDEC EIA/JESD51 standards. Care should be taken to ensure the thermocouple bead is touching the case. 5. Operating ambient temperature surrounding the package.
Table 14:
Thermal Impedance Simulated Values
JA (C/W) Airflow = 0m/s 81 44 64.9 51.5 67 40.9 JA (C/W) Airflow = 1m/s 63.8 47.3 50.8 41.6 51.2 35.1 JA (C/W) Airflow = 2m/s 57.6 44.5 44.8 38.1 47.8 32.2
Die Revision D
Package 54-pin TSOP 54-ball VFBGA 60-ball FBGA Notes:
Substrate 2-layer 4-layer 2-layer 4-layer 2-layer 4-layer
JB (C/W) 45.3 39.1 31.4 31.4 19.7 18.6
JC (C/W) 10.3 3.2 6.7
1. For designs expected to last beyond the die revision listed, contact Micron Applications Engineering to confirm thermal impedance values. 2. Thermal resistance data is sampled from multiple lots, and the values should be viewed as typical. 3. These are estimates; actual results may vary.
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Figure 33: Example Temperature Test Point Location, 54-Pin TSOP: Top View
22.22mm 11.11mm Test point
10.16mm 5.08mm
Figure 34:
Example Temperature Test Point Location, 54-Ball VFBGA: Top View
8.00mm 4.00mm
Test point 14.00mm
7.00mm
Figure 35:
Example Temperature Test Point Location, 60-Ball FBGA: Top View
8.00mm 4.00mm
Test point
16.00mm
8.00mm
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Table 15: DC Electrical Characteristics and Operating Conditions
Notes 1, 5, 6 apply to the entire table; notes appear on page 54; VDD, VDDQ = +3.3V 0.3V Parameter/Condition Supply voltage Input high voltage: Logic 1; All inputs Input low voltage: Logic 0; All inputs Input leakage current: Any input 0V Vin VDD (All other pins not under test = 0V) Output leakage current: DQs are disabled; 0V Vout VDDQ Output levels: Output high voltage (IOUT = -4mA) Output low voltage (IOUT = 4mA) Symbol VDD, VDDQ VIH VIL II IOZ Min 3 2 -0.3 -5 -5 Max 3.6 VDD + 0.3 0.8 5 5 Units V V V A A Notes 22 22
VOH VOL
2.4 -
- 0.4
V V
Table 16:
IDD Specifications and Conditions (-6A)
Notes 1, 5, 6, 11, 13 apply to the entire table; notes appear on page 54; VDD/VDDQ = +3.3V 0.3V Symbol
tRC tRC
Parameter/Condition Operating current: Active mode; Burst = 2; READ or WRITE; = (MIN) Standby current: Power-down mode; All device banks idle; CKE = LOW Standby current: Active mode; CKE = HIGH; CS# = HIGH; All device banks active after tRCD met; No accesses in progress Operating current: Burst mode; Continuous burst; READ or WRITE; All device banks active tRFC = tRFC (MIN) Auto refresh current: CS# = HIGH; CKE = HIGH tRFC = 8.125s Self refresh current: CKE 0.2V
-6A 135 2 40 135 285 3.5 2.5
Units mA mA mA mA mA mA mA
Notes 3, 18, 19, 29 30 3, 12, 19, 29 3, 18, 19, 29 3, 12, 18, 19, 29, 30 4
IDD1 IDD2 IDD3 IDD4 IDD5 IDD6 IDD7
Table 17:
IDD Specifications and Conditions (-7E, -75)
Notes 1, 5, 6, 11, 13 apply to the entire table; notes appear on page 54; VDD, VDDQ = +3.3V 0.3V Max
Parameter/Condition Operating current: Active mode; Burst = 2; Read or write; tRC = tRC (MIN) Standby current: Power-down mode; All banks idle; CKE = LOW Standby current: Active mode; CKE = HIGH; CS# = HIGH; All banks active after tRCD met; No accesses in progress Operating current: Burst mode; Page burst; Read or write; All banks active tRFC = tRFC (MIN) Auto refresh current: tRFC = 7.81s CS# = HIGH; CKE = HIGH Self refresh current: CKE 0.2V Standard Low power (L)
Symbol IDD1 IDD2 IDD3
-7E 135 2 40
-75 125 2 40
Units mA mA mA
Notes 3, 18, 19, 32 32 3, 12, 19, 32 3, 18, 19, 32 3, 12, 18, 19, 32, 33 4
IDD4 IDD5 IDD6 IDD7 IDD7
135 285 3.5 2.5 1.5
135 270 3.5 2.5 1.5
mA mA mA mA mA
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Table 18: Capacitance
Note 2 applies to the entire table; notes appear on page 54 Parameter - TSOP "TG" Package Input capacitance: CLK Input capacitance: All other input-only pins Input/output capacitance: DQs Parameter - FBGA "FB" and "FG" Package Input capacitance: CLK Input capacitance: All other input-only pins Input/output capacitance: DQs CI1 CI2 CIO 1.5 1.5 3.0 3.5 3.8 6.0 pF pF pF 34 35 36 Symbol CI1 CI2 CIO Min 2.5 2.5 4.0 Max 3.5 3.8 6.0 Units pF pF pF Notes 29 30 31
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Table 19: Electrical Characteristics and Recommended AC Operating Conditions (-6A)
-6A Parameter Access time from CLK (positive edge) Address hold time Address setup time CLK high-level width CLK low-level width Clock cycle time CKE hold time CKE setup time CS#, RAS#, CAS#, WE#, DQM hold time CS#, RAS#, CAS#, WE#, DQM setup time Data-in hold time Data-in setup time Data-out high-impedance time Data-out low-impedance time Data-out hold time (load) Data-out hold time (no load) ACTIVE to PRECHARGE command ACTIVE to ACTIVE command period ACTIVE to READ or WRITE delay Refresh period AUTO REFRESH period PRECHARGE command period ACTIVE bank a to ACTIVE bank b command Transition time WRITE recovery time1 Exit SELF REFRESH to ACTIVE command
t
Notes 5, 6, 8, 9, 11, 31 apply to the entire table; notes appear on page 54
Symbol CL = 3
t
Min - 0.8 1.5 2.5 2.5 6 0.8 1.5 0.8 1.5 0.8 1.5 - 1 3 1.8 42 60 18 - 60 18 12 0.3 1 CLK + 6ns 12 67
Max 5.4 - - - - - - - - 1.5 - - 5.4 - - - 120,000 - - 64 - - - 1.2 - - -
Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ms ns ns ns ns ns ns ns
Notes 27
AC(3)
tAH t t
AS CL
CH
t
CL = 3
t
CK(3)
tCKS
23
tCKH
tCMH tCMS tDH tDS
CL = 3
tHZ(3) tLZ tOH tOHN tRAS tRC tRCD tREF tRFC tRP tRRD tT
10
28
7
WR
t
XSR
25 20
Notes: 1. Auto precharge mode only. The precharge timing budget (tRP) begins 6ns for -6A after the first clock delay, after the last WRITE is executed. May not exceed limit set for precharge mode.
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Table 20: Electrical Characteristics and Recommended AC Operating Conditions (-7E, -75)
Notes 5, 6, 8, 9, 11 apply to the entire table; notes appear on page 54 -7E Parameter Access time from CLK (positive edge) Address hold time Address setup time CLK high-level width CLK low-level width Clock cycle time CL = 3 CL = 2 Symbol
t t
-75 Max 5.4 5.4 - - - - - - - - - - - - 5.4 5.4 - - - 120,000 - - 64 - - - 1.2 - - - - Min - - 0.8 1.5 2.5 2.5 7.5 10 0.8 1.5 0.8 1.5 0.8 1.5 - - 1 3 1.8 44 66 20 66 20 15 0.3 1 CLK + 7.5ns 15 75 Max 5.4 6 - - - - - - - - - - - - 5.4 6 - - - 120,000 - - 64 - - - 1.2 - - - - Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ms ns ns ns ns ns ns ns Notes 27
Min - - 0.8 1.5 2.5 2.5 7 7.5 0.8 1.5 0.8 1.5 0.8 1.5 - - 1 3 1.8 37 60 15 - 66 15 14 0.3 1 CLK + 7ns 14 67
CL = 3 CL = 2
CKE hold time CKE setup time CS#, RAS#, CAS#, WE#, DQM hold time CS#, RAS#, CAS#, WE#, DQM setup time Data-in hold time Data-in setup time CL = 3 Data-out High-Z time CL = 2 Data-out Low-Z time Data-out hold time (load) Data-out hold time (no load) ACTIVE-to-PRECHARGE command ACTIVE-to-ACTIVE command period ACTIVE-to-READ or WRITE delay Refresh period (8,192 rows) Auto refresh period PRECHARGE command period ACTIVE bank a to ACTIVE bank b command Transition time Write recovery time
AC(3) AC(2) t AH t AS t CH t CL tCK(3) tCK(2) t CKH tCKS tCMH tCMS tDH tDS tHZ(3) tHZ(2) tLZ tOH tOHN tRAS tRC tRCD tREF tRFC tRP tRRD
tT t
23 23 37
10 10
28
WR
7 24 25 20
Exit SELF REFRESH to ACTIVE command
t
XSR
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256Mb: x4, x8, x16 SDRAM Electrical Specifications
Table 21:
Parameter READ/WRITE command to READ/WRITE command CKE to clock disable or power-down entry mode CKE to clock enable or power-down exit setup mode DQM to input data delay DQM to data mask during WRITEs DQM to data high-impedance during READs WRITE command to input data delay Data-in to ACTIVE command Data-in to PRECHARGE command Last data-in to burst STOP command Last data-in to new READ/WRITE command Last data-in to PRECHARGE command LOAD MODE REGISTER command to ACTIVE or REFRESH command Data-out to high-impedance from PRECHARGE command CL = 3
AC Functional Characteristics (-6A)
Notes 5, 6, 7, 8, 9, 11 apply to the entire table; notes appear on page 54 Symbol
t
-6A 1 1 1 0 0 2 0 4 2 1 1 2 2 3
Units
t
Notes 17 14 14 17 17 17 17 15, 211 16, 21 17 17 16, 21 26 17
CCD
CK
tCKED tPED t t
tCK tCK t t t
DQD DQZ
CK CK CK
DQM
t
tDWD tDAL tDPL tBDL tCDL tRDL tMRD tROH(3)
tCK tCK tCK tCK tCK tCK tCK tCK
Notes: 1. Note 21 on page 54 does not apply for this speed grade and should read "Based on tCK = 6ns."
Table 22:
Parameter
AC Functional Characteristics (-7E, -75)
Notes 5, 6, 7, 8, 9, 11 apply to the entire table; notes appear on page 54 Symbol
tCCD tCKED tPED tDQD tDQM
-7E 1 1 1 0 0 2 0 4 2 1 1 2 2 3 2
-75 1 1 1 0 0 2 0 5 2 1 1 2 2 3 2
Units
tCK tCK tCK tCK tCK t t
Notes 17 14 14 17 17 17 17 15, 21 16, 21 17 17 16, 21 26 17 17
READ/WRITE command to READ/WRITE command CKE to clock disable or power-down entry mode CKE to clock enable or power-down exit setup mode DQM to input data delay DQM to data mask during WRITEs DQM to data High-Z during READs WRITE command to input data delay Data-in to ACTIVE command Data-in to PRECHARGE command Last data-in to BURST STOP command Last data-in to new READ/WRITE command Last data-in to PRECHARGE command LOAD MODE REGISTER command to ACTIVE or REFRESH command Data-out to High-Z from PRECHARGE command CL = 3 CL = 2
DQZ DWD tDAL tDPL tBDL t CDL t RDL tMRD tROH(3) tROH(2)
t
t
CK CK tCK tCK tCK t CK t CK tCK tCK tCK
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256Mb: x4, x8, x16 SDRAM Notes
Notes
1. All voltages referenced to VSS. 2. This parameter is sampled. VDD, VDDQ = +3.3V; f = 1 MHz, TA = 25C; pin under test biased at 1.4V. 3. IDD is dependent on output loading and cycle rates. Specified values are obtained with minimum cycle time and the outputs open. 4. Enables on-chip refresh and address counters. 5. The minimum specifications are used only to indicate cycle time at which proper operation over the full temperature range is ensured; (0C TA +70C for commercial) and (-40C TA +85C for IT). 6. An initial pause of 100s is required after power-up, followed by two AUTO REFRESH commands, before proper device operation is ensured. (VDD and VDDQ must be powered up simultaneously. VSS and VSSQ must be at same potential.) The two AUTO REFRESH command wake-ups should be repeated any time the tREF refresh requirement is exceeded. 7. AC characteristics assume tT = 1ns. 8. In addition to meeting the transition rate specification, the clock and CKE must transit between VIH and VIL (or between VIL and VIH) in a monotonic manner. 9. Outputs measured at 1.5V with equivalent load:
Q 50pF
10. tHZ defines the time at which the output achieves the open circuit condition; it is not a reference to VOH or VOL. The last valid data element will meet tOH before going High-Z. 11. AC operating and IDD test conditions have VIL = 0V and VIH = 3.0V using a measurement reference level of 1.5V. If the input transition time is longer than 1ns, then the timing is measured from VIL (MAX) and VIH (MIN) and no longer from the 1.5V midpoint. CLK should always be 1.5V referenced to crossover. Refer to Micron technical note TN-48-09. 12. Other input signals are allowed to transition no more than once every two clocks and are otherwise at valid VIH or VIL levels. 13. IDD specifications are tested after the device is properly initialized. 14. Timing actually specified by tCKS; clock(s) specified as a reference only at minimum cycle rate. 15. Timing actually specified by tWR plus tRP; clock(s) specified as a reference only at minimum cycle rate. 16. Timing actually specified by tWR. 17. Required clocks are specified by JEDEC functionality and are not dependent on any timing parameter. 18. The IDD current will increase or decrease proportionally according to the amount of frequency alteration for the test condition. 19. Address transitions average one transition every two clocks. 20. CLK must be toggled a minimum of two times during this period. 21. Based on tCK = 7.5ns for -75 and -7E.
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256Mb: x4, x8, x16 SDRAM Notes
22. VIH overshoot: VIH (MAX) = VDDQ + 2V for a pulse width 3ns, and the pulse width cannot be greater than one-third of the cycle rate. VIL undershoot: VIL (MIN) = -2V for a pulse width 3ns. 23. The clock frequency must remain constant (stable clock is defined as a signal cycling within timing constraints specified for the clock pin) during access or precharge states (READ, WRITE, including tWR, and PRECHARGE commands). CKE may be used to reduce the data rate. 24. Auto precharge mode only. The precharge timing budget (tRP) begins 7ns for -7E and 7.5ns for -75 after the first clock delay, after the last WRITE is executed. 25. Precharge mode only. 26. JEDEC and PC100 specify three clocks. 27. tAC for -75/-7E at CL = 3 with no load is 4.6ns and is guaranteed by design. 28. Parameter guaranteed by design. 29. PC100 specifies a maximum of 4pF. 30. PC100 specifies a maximum of 5pF. 31. PC100 specifies a maximum of 6.5pF. 32. For -75, CL = 3 and tCK = 7.5ns; for -7E, CL = 2 and tCK = 7.5ns. 33. CKE is HIGH during REFRESH command period tRFC (MIN) else CKE is LOW. The IDD6 limit is actually a nominal value and does not result in a fail value. 34. PC133 specifies a minimum of 2.5pF. 35. PC133 specifies a minimum of 2.5pF. 36. PC133 specifies a minimum of 3.0pF. 37. For operating frequencies 45 MHz, tCKS = 3.0ns.
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256Mb: x4, x8, x16 SDRAM Timing Diagrams
Timing Diagrams
Figure 36: Initialize and Load Mode Register
T0 CK (( ))
(( )) (( ))
tCK
T1
tCKS
tCKH
(( )) (( )) (( )) (( ))
Tn + 1 tCH
(( )) (( ))
To + 1 tCL
(( )) (( ))
Tp + 1
Tp + 2
Tp + 3
CKE
(( ))
(( ))
tCMS tCMH COMMAND
(( )) (( ))
NOP
PRECHARGE
(( )) (( ))
AUTO REFRESH
(( )) NOP NOP (( )) (( )) (( ))
AUTO REFRESH
(( )) NOP NOP (( )) (( )) (( ))
LOAD MODE REGISTER
NOP
ACTIVE
DQM/ DQML, DQMU
(( )) (( ))
(( )) (( )) (( )) (( )) (( )) (( ))
A0-A9, A11, A12
(( )) (( )) (( )) (( )) (( )) (( ))
(( )) (( )) (( )) (( )) (( )) (( ))
(( )) (( )) (( )) (( )) (( )) (( ))
tAS
tAH 5
ROW
CODE
ALL BANKS SINGLE BANK
tAS
tAH
ROW
A10
CODE
BA0, BA1
ALL BANKS
(( )) (( ))
BANK
DQ
(( )) T = 100s MIN Power-up: VDD and CLK stable
High-Z
(( )) tRP tRFC tRFC tMRD
Precharge all banks
AUTO REFRESH
AUTO REFRESH
Program Mode Register 1, 3, 4 DON'T CARE UNDEFINED
Notes:
1. 2. 3. 4. 5.
The mode register may be loaded prior to the AUTO REFRESH cycles if desired. If CS is HIGH at clock HIGH time, all commands applied are NOP. JEDEC and PC100 specify three clocks. Outputs are guaranteed High-Z after command is issued. A12 should be a LOW at tP + 1.
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256Mb: x4, x8, x16 SDRAM Timing Diagrams
Figure 37: Power-Down Mode
T0 CLK tCK T1 tCL tCKS CKE tCKS tCKH tCH T2
(( )) (( )) (( )) (( ))
Tn + 1
Tn + 2
tCKS
(( ))
(( ))
tCMS tCMH COMMAND
PRECHARGE NOP NOP
(( )) (( )) (( )) (( )) (( )) (( ))
(( )) (( )) (( )) (( )) (( )) (( )) (( )) (( ))
NOP
ACTIVE
DQM/ DQML, DQMU
A0-A9, A11, A12
ALL BANKS
ROW
A10
SINGLE BANK
(( )) (( ))
ROW
tAS BA0, BA1
tAH
(( )) (( ))
(( ))
BANK(S)
(( )) (( ))
(( ))
BANK
High-Z
DQ Two clock cycles Precharge all active banks All banks idle, enter power-down mode
Input buffers gated off while in power-down mode All banks idle Exit power-down mode DON'T CARE UNDEFINED
Notes:
1. Violating refresh requirements during power-down may result in a loss of data.
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256Mb: x4, x8, x16 SDRAM Timing Diagrams
Figure 38:
CLK
Clock Suspend Mode
T0 tCK T1 tCL tCH tCKS tCKH T2 T3 T4 T5 T6 T7 T8 T9
CKE tCKS tCKH
tCMS tCMH COMMAND
READ NOP NOP NOP NOP NOP WRITE NOP
tCMS tCMH DQM/ DQML, DQMU A0-A9, A11, A12
tAS
tAH
2 COLUMN e 2
COLUMN m
tAS A10 tAS BA0, BA1
tAH
tAH
BANK BANK
tAC tAC DQ tLZ
DOUT m
tOH
tHZ
DOUT m + 1
tDS
tDH
DIN e DIN + 1
DON'T CARE UNDEFINED
Notes:
1. For this example, BL = 2, CL = 3, and auto precharge is disabled. 2. x16: A9, A11 and A12 = "Don't Care" x8: A11 and A12 = "Don't Care" x4: A12 = "Don't Care"
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256Mb: x4, x8, x16 SDRAM Timing Diagrams
Figure 39: Auto Refresh Mode
T0
CLK tCK
T1
T2
tCH
(( )) (( )) (( ))
Tn + 1
tCL
(( )) (( )) (( ))
To + 1
CKE tCKS tCMS COMMAND tCKH tCMH
NOP AUTO REFRESH
PRECHARGE
NOP
(( )) ( ( NOP ))
AUTO REFRESH
NOP
(( )) ( ( NOP )) (( )) (( ))
(( )) (( )) (( )) (( ))
ACTIVE
DQM/ DQML, DQMU
(( )) (( ))
(( )) (( ))
A0-A9, A11, A12
ALL BANKS
ROW
A10
SINGLE BANK tAS BA0, BA1 tAH
(( )) (( ))
ROW
BANK(S)
(( )) (( )) (( )) tRP tRFC tRFC
(( )) (( )) (( ))
BANK
DQ
High-Z
Precharge all active banks
DON'T CARE
Notes:
1. tRFC must not be interrupted by any executable command; COMMAND INHIBIT or NOP must be applied on each positive edge during tRFC.
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256Mb: x4, x8, x16 SDRAM Timing Diagrams
Figure 40: Self Refresh Mode
T0 CLK tCK T1 tCH tCL T2
(( )) (( ))
Tn + 1
tCKS
tRAS(MIN)1
(( ))
(( )) (( )) (( )) (( ))
To + 1
To + 2
CKE tCKS tCMS COMMAND tCKH tCMH
NOP AUTO REFRESH
PRECHARGE
(( )) (( )) (( )) (( )) (( )) (( ))
NOP ( (
(( ) )or COMMAND
INHIBIT
AUTO REFRESH
))
DQM/ DQML, DQMU
(( )) (( )) (( )) (( )) (( )) (( ))
A0-A9, A11,A12
ALL BANKS
A10
SINGLE BANK
(( )) (( ))
t AS BA0, BA1
tAH
(( )) (( )) (( )) (( ))
BANK(S)
DQ
High-Z tRP Precharge all active banks
(( ))
(( ))
tXSR2 Enter self refresh mode Exit self refresh mode (Restart refresh time base) DON'T CARE
CLK stable prior to exiting self refresh mode
Notes:
1. 2. 3.
No maximum time limit for self refresh. tRAS (MAX) applies to non-self refresh mode. requires minimum of two clocks regardless of frequency or timing. As a general rule, any time self refresh is exited, the DRAM may not reenter the self refresh mode until all rows have been refreshed by the AUTO REFRESH command at the distributed refresh rate, tREF, or faster. However, the following exceptions are allowed: 3a. The DRAM has been in self refresh mode for a minimum of 64mS prior to exiting. 3b. tXSR is not violated. 3c. At least two AUTO REFRESH commands are preformed during each 7.81s interval while the DRAM remains out of the self refresh mode.
tXSR
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256Mb: x4, x8, x16 SDRAM Timing Diagrams
Figure 41: Read - Without Auto Precharge
T0 CLK tCKS CKE tCMS COMMAND tCMH
NOP READ NOP NOP NOP PRECHARGE NOP ACTIVE
T1 tCK tCKH tCL
T2 tCH
T3
T4
T5
T6
T7
T8
ACTIVE
tCMS DQM/ DQML, DQMU tAS A0-A9, A11, A12 tAS A10 tAS BA0, BA1 tAH
ROW
tCMH
COLUMN m 2
ROW
tAH
ROW
ALL BANKS ROW DISABLE AUTO PRECHARGE BANK SINGLE BANK BANK BANK
tAH
BANK
tAC DQ tRCD tRAS tRC tLZ CAS Latency
tAC tOH
DOUT m
tAC tOH
DOUT m + 1
tAC tOH
DOUT m + 2
tOH
DOUT m + 3
tHZ tRP
DON'T CARE UNDEFINED
Notes:
1. For this example, BL = 4, CL = 2, and the READ burst is followed by a "manual" PRECHARGE. 2. x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care" x4: A12 = "Don't Care"
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256Mb: x4, x8, x16 SDRAM Timing Diagrams
Figure 42: Read - With Auto Precharge
T0 CLK tCKS CKE tCMS tCMH COMMAND
ACTIVE NOP READ NOP NOP NOP NOP NOP ACTIVE
T1 tCK tCKH tCL
T2 tCH
T3
T4
T5
T6
T7
T8
tCMS DQM/ DQML, DQMU tAS A0-A9, A11, A12 tAH
tCMH
ROW
COLUMN m 2
ROW
tAS A10
tAH
ENABLE AUTO PRECHARGE ROW
ROW
tAS BA0, BA1
tAH
BANK BANK
BANK
tAC DQ tRCD tRAS tRC tLZ CAS Latency
tAC tOH
DOUT m
tAC tOH
DOUT m + 1
tAC tOH
DOUT m + 2
tOH
DOUT m + 3
tHZ tRP
DON'T CARE UNDEFINED
Notes:
1. For this example, BL = 4 and CL = 2. 2. x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care"
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256Mb: x4, x8, x16 SDRAM Timing Diagrams
Figure 43: Single Read - Without Auto Precharge
T0 CLK tCKS CKE tCMS tCMH COMMAND ACTIVE NOP READ tCMS DQM/ DQML, DQMU tAS A0-A9, A11,A12 tAS A10 tAS BA0, BA1 tAH ROW tAH ROW tAH BANK DISABLE AUTO PRECHARGE BANK tAC DQ tRCD tRAS tRC DON'T CARE UNDEFINED tLZ CAS Latency tOH DOUT m tHZ tRP SINGLE BANKS BANK(S) BANK
COLUMN m3
T1 tCK tCKH tCL
T2 tCH
T3
T4
T5
T6
T7
T8
NOP 2
NOP 2
PRECHARGE
NOP
ACTIVE
NOP
tCMH
ROW ALL BANKS ROW
Notes:
1. For this example, BL = 1, CL = 2, and the READ burst is followed by a "manual" PRECHARGE. 2. PRECHARGE command not allowed (would violate tRAS). 3. x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care" x4: A12 = "Don't Care"
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256Mb: x4, x8, x16 SDRAM Timing Diagrams
Figure 44: Single Read - With Auto Precharge
T0 CLK tCKS CKE tCMS tCMH COMMAND
ACTIVE NOP NOP2 NOP2 READ NOP NOP ACTIVE NOP
T1 tCK tCKH tCL
T2 tCH
T3
T4
T5
T6
T7
T8
tCMS DQM/ DQML, DQMU tAS A0-A9, A11 tAH
tCMH
ROW
COLUMN m3
ROW
tAS A10
tAH
ENABLE AUTO PRECHARGE ROW
ROW
tAS BA0, BA1
tAH
BANK BANK
BANK
tAC t OH DQ tRCD tRAS tRC CAS Latency tRP
DOUT m
tHZ
DON'T CARE UNDEFINED
Notes:
1. For this example, BL = 1 and CL = 2. 2. PRECHARGE command not allowed (would violate tRAS). 3. x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care" x4: A12 = "Don't Care"
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256Mb: x4, x8, x16 SDRAM Timing Diagrams
Figure 45: Alternating Bank Read Accesses
T0 CLK tCKS CKE tCMS COMMAND tCMH
NOP READ NOP ACTIVE NOP READ NOP ACTIVE
T1 tCK tCKH tCL
T2 tCH
T3
T4
T5
T6
T7
T8
ACTIVE
tCMS DQM/ DQML, DQMU tAS A0-A9, A11, A12 tAH
tCMH
ROW
COLUMN m 2
ROW
COLUMN b 2
ROW
tAS A10
tAH
ENABLE AUTO PRECHARGE ROW
ENABLE AUTO PRECHARGE ROW
ROW
tAS BA0, BA1
tAH
BANK 0 BANK 3 BANK 3 BANK 0
BANK 0
tAC DQ tRCD - BANK 0 tRAS - BANK 0 tRC - BANK 0 tRRD tLZ CAS Latency - BANK 0
tAC tOH
DOUT m
tAC tOH
DOUT m + 1
tAC tOH
DOUT m + 2
tAC tOH
DOUT m + 3
tAC tOH
DOUT b
tRP - BANK 0
tRCD - BANK 0
tRCD - BANK 3
CAS Latency - BANK 3
DON'T CARE UNDEFINED
Notes:
1. For this example, BL = 4 and CL = 2. 2. x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care" x4: A12 = "Don't Care"
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256Mb: x4, x8, x16 SDRAM Timing Diagrams
Figure 46:
CLK tCKS CKE tCMS COMMAND tCMH
NOP READ NOP NOP NOP NOP
Read - Full-Page Burst
T0 tCL tCH tCKH
(( )) (( )) (( )) (( )) (( )) (( ))
T1 tCK
T2
T3
T4
T5
T6
(( )) (( ))
Tn + 1
Tn + 2
Tn + 3
Tn + 4
ACTIVE
NOP
BURST TERM
NOP
NOP
tCMS DQM/ DQML, DQMU tAS A0-A9, A11, A12 tAH
tCMH
ROW
COLUMN m 2
(( )) (( ))
tAS A10
tAH
ROW
(( )) (( ))
tAS BA0, BA1
tAH
BANK
BANK
(( )) (( ))
tAC tAC DQ tLZ tRCD CAS Latency tOH
DOUT m
tAC tOH
DOUT m+1
tAC ( ( tOH ) )
(( )) DOUT m+2 (( ))
tAC tOH
DOUT m-1
tAC tOH
Dout m
tOH
DOUT m+1
512 (x16) locations within same row 1,024 (x8) locations within same row 2,048 (x4) locations within same row
tHZ
Full page completed Full-page burst does not self-terminate. 3 Can use BURST TERMINATE command.
DON'T CARE UNDEFINED
Notes:
1. For this example, CL = 2. 2. x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care" x4: A12 = "Don't Care" 3. Page left open; no tRP.
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256Mb: x4, x8, x16 SDRAM Timing Diagrams
Figure 47: Read - DQM Operation
T0 CLK tCKS CKE tCMS COMMAND tCMH
NOP READ NOP NOP NOP NOP NOP NOP
T1 tCK tCKH tCL
T2 tCH
T3
T4
T5
T6
T7
T8
ACTIVE
tCMS DQM/ DQML, DQMU tAS A0-A9, A11, A12 tAH
tCMH
ROW
COLUMN m 2 ENABLE AUTO PRECHARGE
tAS A10
tAH
ROW
tAS BA0, BA1
tAH
BANK
DISABLE AUTO PRECHARGE BANK
tAC DQ tLZ tRCD CAS Latency
tOH
DOUT m
tAC
tAC tOH
DOUT m + 2
tOH
DOUT m + 3
tHZ
tLZ
tHZ
DON'T CARE UNDEFINED
Notes:
1. For this example, BL = 4 and CL = 2. 2. x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care" x4: A12 = "Don't Care"
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Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM Timing Diagrams
Figure 48:
CLK tCKS CKE tCMS COMMAND tCMH
NOP WRITE NOP NOP NOP NOP PRECHARGE NOP ACTIVE
Write - Without Auto Precharge
T0 tCK tCKH T1 tCL T2 tCH T3 T4 T5 T6 T7 T8 T9
ACTIVE
tCMS tCMH DQM/ DQML, DQMU tAS A0-A9, A11, A12 tAH
COLUMN m2 ALL BANKs ROW DISABLE AUTO PRECHARGE BANK SINGLE BANK BANK BANK ROW
ROW
tAS A10
tAH
ROW
tAS BA0, BA1
tAH
BANK
tDS DQ tRCD tRAS tRC
tDH DIN m
tDS
tDH
tDS
tDH
tDS
tDH
DIN m + 1
DIN m + 2
DIN m + 3 t WR 3 tRP
DON'T CARE
Notes:
1. For this example, BL = 4, and the WRITE burst is followed by a "manual" PRECHARGE. 2. 14ns to 15ns is required between and the PRECHARGE command, regardless of frequency. 3. x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care" x4: A12 = "Don't Care"
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Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM Timing Diagrams
Figure 49:
CLK tCKS CKE tCMS COMMAND tCMH
NOP WRITE NOP NOP NOP NOP NOP NOP ACTIVE
Write - With Auto Precharge
T0 tCK tCKH T1 tCL T2 tCH T3 T4 T5 T6 T7 T8 T9
ACTIVE
tCMS tCMH DQM/ DQML, DQMU tAS A0-A9, A11, A12 tAH
COLUMN m 2 ENABLE AUTO PRECHARGE ROW ROW
ROW
tAS A10
tAH
ROW
tAS BA0, BA1
tAH
BANK BANK
BANK
tDS DQ tRCD tRAS tRC
tDH DIN m
tDS
tDH
tDS
tDH
tDS
tDH
DIN m + 1
DIN m + 2
DIN m + 3 tWR tRP
DON'T CARE
Notes:
1. For this example, BL = 4. 2. x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care" x4: A12 = "Don't Care"
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Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM Timing Diagrams
Figure 50: Single Write - Without Auto Precharge
T0 CLK tCKS CKE tCMS COMMAND tCMH
NOP WRITE NOP 2 NOP 2 PRECHARGE NOP ACTIVE NOP
tCK tCKH
T1
tCL
T2 tCH
T3
T4
T5
T6
T7
T8
ACTIVE
tCMS tCMH DQM/ DQML, DQMU tAS A0-A9, A11 tAH
COLUMN m 3 ALL BANKS ROW DISABLE AUTO PRECHARGE BANK SINGLE BANK BANK BANK
ROW
tAS A10
tAH
ROW
tAS BA0, BA1
tAH
BANK
tDS DQ tRCD tRAS tRC
tDH DIN m t WR 4 tRP
DON'T CARE
Notes:
1. For this example, BL = 1, and the WRITE burst is followed by a "manual" PRECHARGE. 2. 14ns to 15ns is required between and the PRECHARGE command, regardless of frequency. With a single WRITE, tWR has been increased to meet minimum tRAS requirement. 3. x16: A8, A9, and A11 = "Don't Care" x8: A9 and A11 = "Don't Care" x4: A11 = "Don't Care" 4. PRECHARGE command not allowed (would violate tRAS).
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Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM Timing Diagrams
Figure 51:
CK tCKS CKE tCMS COMMAND tCMH
NOP2 NOP2 NOP2 WRITE NOP NOP NOP ACTIVE NOP
Single Write - With Auto Precharge
T0 tCK tCKH T1 tCL T2 tCH T3 T4 T5 T6 T7 T8 T9
ACTIVE
tCMS DQM/ DQML, DQMU tAS A0-A9, A11, A12 tAH
tCMH
ROW
COLUMN m3 ENABLE AUTO PRECHARGE
ROW
tAS A10
tAH
ROW
ROW
tAS BA0, BA1
tAH
BANK BANK
BANK
tDS DQ tRCD tRAS tRC
tDH DIN m tWR4 tRP
DON'T CARE
Notes:
1. For this example, BL = 1. 2. Requires one clock plus time (7ns to 7.5ns) with auto precharge or 14ns to 15ns with PRECHARGE. 3. x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care" x4: A12 = "Don't Care" 4. WRITE command not allowed (would violate tRAS).
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Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM Timing Diagrams
Figure 52:
CLK tCKS CKE tCMS COMMAND tCMH
NOP WRITE NOP ACTIVE NOP WRITE NOP NOP ACTIVE
Alternating Bank Write Accesses
T0 tCK tCKH T1 tCL T2 tCH T3 T4 T5 T6 T7 T8 T9
ACTIVE
tCMS DQM/ DQML, DQMU tAS A0-A9, A11, A12 tAH
tCMH
ROW
COLUMN m 3
ROW
COLUMN b 3
ROW
tAS A10
tAH
ENABLE AUTO PRECHARGE ROW
ENABLE AUTO PRECHARGE ROW
ROW
tAS BA0, BA1
tAH
BANK 0 BANK 1 BANK 1 BANK 0
BANK 0
tDS DQ tRCD - BANK 0 tRAS - BANK 0 tRC - BANK 0 tRRD
tDH DIN m
tDS
tDH
tDS
tDH
tDS
tDH
tDS
tDH DIN b
tDS
tDH
tDS
tDH
tDS
tDH
DIN m + 1
DIN m + 2
DIN m + 3
DIN b + 1
DIN b + 2 tRP - BANK 0
DIN b + 3 tRCD - BANK 0
tWR - BANK 0
tRCD - BANK 1
tWR - BANK 1
DON'T CARE
Notes:
1. For this example, BL = 4. 2. Requires one clock plus time (7ns or 7.5ns) with auto precharge or 14ns to 15ns with PRECHARGE. 3. x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care" x4: A12 = "Don't Care"
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Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM Timing Diagrams
Figure 53: Write - Full-Page Burst
T0 CLK tCKS CKE tCMS COMMAND tCMH
NOP WRITE NOP NOP NOP
T1 tCL tCH tCKH tCK
T2
T3
T4
T5
(( )) (( ))
Tn + 1
Tn + 2
Tn + 3
(( )) (( )) (( )) (( ))
ACTIVE
NOP
BURST TERM
NOP
tCMS tCMH DQM/ DQML, DQMU tAS A0-A9, A11, A12 tAH
COLUMN m 1
(( )) (( ))
ROW
(( )) (( ))
tAS A10
tAH
ROW
(( )) (( ))
tAS BA0, BA1
tAH
BANK
BANK
(( )) (( ))
tDS DQ tRCD
tDH DIN m
tDS
tDH
tDS
tDH
tDS
tDH
DIN m + 1
DIN m + 2
DIN m + 3
(( )) (( ))
tDS
tDH
DIN m - 1 Full-page burst does not self-terminate. Can use BURST TERMINATE command to stop.2, 3
512 (x16) locations within same row 1,024 (x8) locations within same row 2,048 (x4) locations within same row
Full page completed
DON'T CARE
Notes:
1. x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care" x4: A12 = "Don't Care" 2. tWR must be satisfied prior to PRECHARGE command. 3. Page left open; no tRP.
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Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM Timing Diagrams
Figure 54: Write - DQM Operation
T0 CLK tCKS CKE tCMS COMMAND tCMH
NOP WRITE NOP NOP NOP NOP NOP
T1 tCK tCKH tCL
T2 tCH
T3
T4
T5
T6
T7
ACTIVE
tCMS tCMH DQM/ DQML, DQMU tAS A0-A9, A11, A12 tAH
COLUMN m 2 ENABLE AUTO PRECHARGE
ROW
tAS A10
tAH
ROW
tAS BA0, BA1
tAH
DISABLE AUTO PRECHARGE BANK
BANK
tDS DQ tRCD
tDH
DIN m
tDS
tDH
tDS
tDH
DIN m + 2
DIN m + 3
DON'T CARE
Notes:
1. For this example, BL = 4. 2. x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care" x4: A12 = "Don't Care"
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Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM Package Dimensions
Package Dimensions
Figure 55: 54-Pin Plastic TSOP (400 mil)
0.10 1.2 MAX 0.375 0.075 TYP PIN #1 ID
22.22 .08 2X R 0.75 2X R 1.00 2X 0.71
0.80 TYP (FOR REFERENCE ONLY)
2X 0.10 2.80 10.16 0.08 11.76 0.20 SEE DETAIL A 0.15 +0.03 -0.02
PLATED LEAD FINISH: 90% Sn, 10% Pb OR 100%Sn PLASTIC PACKAGE MATERIAL: EPOXY NOVOLAC PACKAGE WIDTH AND LENGTH DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 PER SIDE. GAGE PLANE 0.25 +0.10 0.10 -0.05
0.50 0.10 0.80 DETAIL A
Notes:
1. All dimensions in millimeters. 2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side. 3. "2X" means the notch is present in two locations (both ends of the device).
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Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM Package Dimensions
Figure 56: 60-Ball FBGA "FB" Package, 8mm x 16mm (x4, x8)
0.850 0.05 0.10 A SEATING PLANE 2.40 0.05 CTR 60X O 0.45 DIMENSIONS APPLY TO SOLDER BALLS POST REFLOW. PREREFLOW DIAMETER IS 0.42 ON A 0.33 NSMD BALL PAD. BALL A8 8.00 0.05 16.00 0.10 C L 11.20 5.60 A SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag OR 96.5% Sn. 3% Ag, 0.5% Cu SUBSTRATE: PLASTIC LAMINATE 8.00 0.10 5.60 0.80 TYP BALL #1 ID ENCAPSULATION MATERIAL: EPOXY NOVOLAC BALL #1 ID BALL A1
0.80 TYP
2.80 4.00 0.05 1.20 MAX
Notes:
1. All dimensions in millimeters. 2. Recommended pad size for PCB is 0.33mm 0.025mm. 3. Topside part marking decode can be found at: www.micron.com/support/designsupport/ tools/fbga/decoder.
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Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM Package Dimensions
Figure 57: 54-Ball VFBGA "FG" Package, 8mm x 14mm (x16)
0.65 0.05
SEATING PLANE C
0.10 C
6.40 54X O0.45 SOLDER BALL DIAMETER REFERS TO POST REFLOW CONDITION. THE PREREFLOW DIAMETER IS O0.42 BALL A9 0.80 TYP
1.00 MAX BALL A1 ID
BALL A1 ID BALL A1
0.80 TYP C L 3.20 0.05 7.00 0.05
6.40
14.00 0.10
3.20 0.05
C L 4.00 0.05
MOLD COMPOUND: EPOXY NOVOLAC SUBSTRATE MATERIAL: PLASTIC LAMINATE SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag OR 96.5% Sn, 3%Ag, 0.5% Cu SOLDER MASK DEFINED BALL PADS: O 0.40
8.00 0.10
Notes:
1. All dimensions in millimeters. 2. Recommended pad size for PCB is 0.4mm 0.065mm. 3. Topside part marking decode can be found at: http://www.micron.com/decoder.
(R)
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900 prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992 Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range set forth herein. Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
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Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)1999 Micron Technology, Inc. All rights reserved.

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